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Ultrathin Slices of Ferroelectric Domain-Patterned Lithium Niobate by Crystal Ion Slicing

Published online by Cambridge University Press:  21 March 2011

David A. Scrymgeour ,
Venkat Gopalan ,
Tony E. Haynes  and
Miguel Levy
David A. Scrymgeour
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
Venkat Gopalan
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802
Tony E. Haynes
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Bldg. 3003, MS-6048, P. O. Box 2008, Oak Ridge, TN 37831
Miguel Levy
Affiliation:
Physics Department Michigan Technological University, Houghton, MI 49931
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Abstract

We report the successful fabrication of 6 µm thick slices from a ferroelectric domain micro-engineered LiNbO3 wafer device using the crystal ion slicing technique. The device was created by micropatterning ferroelectric domains in a bulk 0.3 mm thick wafer of z-cut LiNbO3, followed by ion-implanting with 3.8 MeV He+ ions to a fluence 5 × 10+16 ions/cm2 to create a damage layer at a well defined depth from the surface. Etching away this damaged layer in dilute hydrofluoric acid results in a liftoff of the top slice in which the ferroelectric domain patterns are left intact. The influence of annealing conditions on liftoff time and depth of etch lines was studied. Helium-Neon laser light was successfully coupled into the device. Due to unintentional breakage of the polished input and output faces, the electro-optic scanning performance has not been characterized so far.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 681: Symposium I – Wafer Bonding and Thinning Techniques for Materials Integration , 2001 , I6.3
Copyright
Copyright © Materials Research Society 2001

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References

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