Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM

doi: 10.1557/jmr.2012.430, Published by Cambridge University Press, 17 January 2013.

In Sarobol et al.,¹ Fig. 1 is missing the following permission line:

© 2013 IEEE. Reprinted, with permission, from P. Sarobol, A.E. Pedigo, P. Su, J.E. Blendell, and C.A. Handwerker: Defect morphology and texture in Sn, Sn–Cu, and Sn–Cu–Pb electroplated films. IEEE Trans. Electron. Packag. Manuf. 33, 159–164 (2010).

The authors regret the mistake.