The hardness of single-crystal GaN and AlN of 0.5-mm-thickness was measured by the Vickers indentation method in the temperature range 20 - 1400°C. The hardness of GaN and AlN is 10.2 and 17.7 GPa, respectively, at room temperature. The nano-indentation hardness of single-crystal AlN was measured at room temperature as 18 GPa, harder than GaN and InN. Up to about 1100°C, GaN and AlN maintain its hardness similar to that of SiC and thus, a high mechanical stability for GaN and AlN at elevated temperatures is deduced. Yield strength of nitrides is discussed.

We have investigated the dislocation of GaN films grown by hydride vapor phase epitaxy (HVPE) on c-plane sapphire substrates using transmission electron microscopy (TEM), etch pit density (EPD) characteristics, and micro photoluminescence (PL). Micro PL mapping is a nondestructive method for observing defect sites as dark spots which reveal the dislocations causing non-radiative recombination centers in the GaN film surface. The dark spots reveal a decrease in threading dislocation sites with increasing the thickness of GaN films. In order to illustrate the correlation between the thickness and the dislocation density of GaN, the micro PL analysis method was used to observe the dislocation densities of a GaN film with a low dislocation density.

We report characterization of the red emission band in hydride vapor phase epitaxial GaN using cathodoluminescence spectroscopy and imaging and time-resolved photoluminescence. The observed properties of the emission are consistent with recombination of excitons bound at close donor-acceptor pairs. The time evolution of the emission signal during electron beam irradiation supports the association of the red emission with charged centres.

The annealing of implantation induced lattice damage in AlN, GaN and InN was studied by means of the perturbed angular correlation (PAC) technique using the PAC probe 181Hf(181Ta). In all three lattices substantial fractions of the probe atoms occupied substitutional lattice sites after annealing. A detailed investigation of the changes observed during isochronal annealing indicates differences in the recovery process. In GaN the trapping of a unique defect, possibly a Nitrogen vacancy, in an intermediate temperature range was found.

The effect of the initial nitridation of the sapphire substrate on the GaN crystal quality as a function of substrate temperature was studied. GaN layers were grown by plasma-assisted molecular beam epitaxy (MBE) on sapphire substrates nitridated at different substrate temperatures. A strong improvement in the GaN crystal quality was observed at 100 °C nitridation temperature. Symmetric (0004) and asymmetric (10-5) full widths at half maximum (FWHM) of the x-ray rocking curves were 136 and 261 arcsec, respectively. This compares to an x-ray rocking curve full width at half maximum of 818 arcsec (0004) for conventional MBE buffer conditions. For our conventional buffer conditions, sapphire substrates were exposed to a N plasma at temperatures above 500 °C for 10min and then 25~50nm buffers were deposited without annealing at high temperature. The low temperature nitridation also shows an enhancement of the lateral growth of the GaN, resulting in larger grain sizes. The largest grain size achieved was approximately 2.8μm, while the average grain size was approximately 2.4μm at 100 °C nitridation temperature.

We report on the fabrication and characterization of GaN/4H-SiC n-p-n heterojunction bipolar transistors (HBTs). The device structure consists of an n-SiC collector, p-SiC base, and selectively grown n-GaN emitter. The HBTs were grown using metalorganic chemical vapor deposition on SiC substrates. Selective GaN growth through a SiO2 mask was used to avoid damage that would be caused by reactive ion etching. In this report, we demonstrate common base transistor operation with a modest dc current gain of 15 at room temperature and 3 at 300°C.

We have studied epitaxial GaN layers grown by hydride vapour phase epitaxy (HVPE) on porous GaN sublayers formed on SiC substrates. It was shown that these layers can be grown with good surface morphology and high crystalline quality. X-ray, Raman and photoluminescent (PL) measurements showed that the stress in the layers grown on porous GaN was reduced to 0.1-0.2 GPa, while the stress in the layers grown directly on 6H-SiC substrates remains at its usual level of about 1 GPa. Thus, we have shown that growth on porous GaN sublayer is a promising method for fabrication of high quality epitaxial layers of GaN with low strain values.

Optical spectroscopy, including low and room temperature photoluminescence (PL), reflectance, PL measurements in high magnetic fields up to 12 T, and resonantly-enhanced electronic Raman scattering (RERS) in zero and high magnetic field, has been used to investigate exciton and impurity states and surface recombination in high quality heteroepitaxial GaN grown on sapphire and SiC. Theoretical finite-difference calculations of the donor states as a function of magnetic field have been carried out for comparison, including the effects of anisotropy in the effective mass and dielectric constant. Up to six residual donor species are observed in material grown by hydride vapor phase epitaxy (HVPE) and metalorganic chemical vapor deposition (MOCVD) from their n=2 and n=3 two-electron satellites observed in PL and by RERS. The donor-related nature of the relevant transitions is confirmed from their magnetic field dependence, and the spectral resolution is improved at high fields. The Si donor level is determined to have a binding energy of about 21 meV from observation of its two-electron satellite in lightly Si-doped HVPE material. The free exciton binding energy is shown to be about 26.4 meV, independent of strain, based on observations of the n=2 free exciton. The room temperature band-edge PL peak is confirmed to be free excitonic in nature, based on its linewidth and on comparison with simple reflectance measurements. Reflectance from the edge of a thick HVPE layer shows clear evidence of A, B, and C excitons obeying the relevant selection rules at both low and room temperature. Surface chemical treatments are shown to have substantial effects on room temperature PL efficiency. Passivation with ammonium or sodium sulfide solutions, in particular, yields increases in PL efficiency by a factor of five to seven over air-exposed surfaces. The passivation effect is stable in air, lasting at least one month.

The growth rate evolution versus V/III ratio and substrate temperature was studied by means of optical reflectivity during MBE of GaN layers using NH3 as nitrogen source. The GaN desorption becomes observable at temperatures above 800°C and causes the reduction of growth rate accompanied with the surface roughening at temperatures above 850-870°C. Unlike GaAs, which evaporates in accordance with the action mass law, the desorption rate of GaN is found to be almost independent of V/III ratio within the N-rich growth conditions. The activation energy for GaN desorption during the growth is found to be (3.2±0.1)eV. This value is very close to the activation energy for free evaporation. At V/III ratio values exceeding 200 the GaN growth rate reduction caused by violation of the molecular flow regime is observed. The Mg-doped samples grown under these extreme conditions tend to have improved acceptor activation and thus p-type conductivity.

Even in good quality undoped GaN samples, as assessed by the intense excitonic emission, the yellow band is present. This band has been attributed either to a shallow donor to deep double donor pair recombination [1], to a deep donor to a shallow acceptor [2] or to a shallow donor and a deep state [3]. However, its origin is not yet clear. We present data on time resolved spectroscopy compared with steady state results. These results indicate that there is no difference in band shape between steady state and time resolved spectra at all temperatures. However, in some samples there is an increase in intensity of the yellow band. It is concluded that besides a fast emission, due to prompt excitation of the centre, an indirect path from a trap 13.7 meV below the shallow donor is responsible for the long component of the decay and the intensity increase. An emission with a lifetime of ca. 300 ms is also present with a maximum at 2.35 eV.

Free standing GaN platelets were fabricated by hydride vapor phase epitaxy (HVPE). The platelets having a current maximum size of 7×6×0.1 mm3 were obtained by HVPE growth of ~100 μm thick GaN layers on SiC substrates and subsequent removal of the substrates by reactive ion etching (RIE). Surface of the GaN platelets was characterized by reflectance high energy election diffraction (RHEED), and Auger electron spectroscopy (AES). Crystal structure and optical properties of the platelets were studied by x-ray diffraction and photoluminescence (PL), respectively. Raman spectroscopy was also applied for material characterization. Residual strain was detected in the crystals. The stress was eliminated by high temperature anneal.

In N-rich growth conditions, prismatic domains were formed in the initial stage of a cyclotron assisted MBE of GaN over 6H-SiC (0001). They exhibit {10 0} facets and are either voids or amorphous phase. Their density is of a few 109 cm−2 and they are located in a 50 nm layer closest to the substrate surface.