We established a Ca1-xBixMn1-yNiyO3 (0 ≤ x, y ≤ 0.1) powder library using a combinatorial system based on the electrostatic spray deposition method. Single phase perovskite-type structures were identified in all of the powders. To measure electrical conductivity, the powder library was subjected to high-pressure (200 MPa) and heat-treated at 950°C for 1 hour in an oxygen atmosphere. As a representative example, the electrical conductivity of 5%-Bi-substituted CaMnO3-δ showed a higher value (63 S·cm-1) than an unsubstituted powder (13 S·cm-1). The improved electrical conductivity, on the other hand, was still very far from the ideal result (167 S·cm-1).

Ti3SiC2 powder of about 96 wt% purity was produced using TiCx and Si powders. The synthesis process was characterized by an exothermic reaction at ∼985 °C and low activation energy (∼27 kJ/mol) of conversion. Almost complete conversion to Ti3SiC2 phase was observed during sintering. The onset temperature of sintering was found to be at about 1060 °C using dilatometer. The density of nearly 99% (theoretical) was achieved through the pressureless sintering of Ti3SiC2 powder by 1 and 2 wt% Si powder additions. The sample (without sintering aid) sintered at 1500 °C for 4 h showed uniformly distributed angular grains, whereas the bimodal nature of the microstructure was observed when Si was added as a sintering aid.

Carbon nanotube films can be used in a wide range of applications, from fuel cells, storage batteries, and super-capacitors, electron field emitters for displays, x-ray and beam sources, heat sinks and heat spreaders, and chemically robust filtering membranes, to name a few. Present approaches to carbon nanotube film production rely on filtration of a suspension, but creating this suspension requires the use of toxic and hazardous reagents and lengthy processing times. We describe an approach of uniaxial die pressing that incorporates a sacrificial layer to prevent binding of the carbon nanotube film to the compression surfaces. Water, or other solvents, acts as a release agent. No binder is used. The process is scalable in terms of film thickness and area. Development of an extrusion process employing these principles is described.