We propose the techniques for automatic processing of measurement results in the context of golden (typical) device selection and noise figure measurement. These techniques are for golden (typical) device selection and noise figure measurement processing. Automation of measurement result processing and microwave element modeling speeds up a modeling routine and decreases the risk of possible errors. The techniques are validated through modeling of 0.15 μm GaAs pHEMTs with 4 × 40 μm and 4 × 75 μm total gate widths. Two test amplifiers were designed using the developed models. The amplifier modeling results agree well with measurements which confirms the validity of the proposed techniques. The proposed algorithm is potentially applicable to other circuit types (switches, digital, power amplifiers, mixers, oscillators, etc.) but may require different settings in those cases. However, in the presented work, we validated the algorithm for the linear and low-noise amplifiers only.

Differential signaling is very common for high frequency integrated circuit design. Accurate multimode de-embedding at multigigahertz frequencies, however, is a major challenge. The differential and common-mode parameters can be obtained by converting the measured four-port nodal S-parameters into the mixed-mode form. Under certain conditions, it is possible to separate the modes and consider only the entries corresponding to the differential S-parameters. This allows to reduce the measured 4 × 4 matrix to a 2 × 2 matrix and consider the differential device as a two-port network. Thus, the standard de-embedding techniques, derived for two-port networks, can be applied to differential S-parameters. The purpose of this paper is to investigate the applicability of this approach for on-wafer measurements. We describe analytically the conditions under which this method is valid. As an example, a 2:1 transformer, manufactured in Infineon's 0.13 μm CMOS (complementary metal-oxide semiconductor) process, has been characterized. On-chip de-embedding structures have been fabricated using the same process. The results obtained using Short-Open, Thru-Line, and Thru-Line-Reflect de-embedding techniques are compared. Additionally, the results are verified by simulation of a device under test having high-mode conversion.