Skip to main content Accessibility help

We use cookies to distinguish you from other users and to provide you with a better experience on our websites. Close this message to accept cookies or find out how to manage your cookie settings.

Close cookie message
×
  1. Home
  2. Search

Refine search

Refine search

Access:
Content type:
Publication date:
Apply   From and To filters
Subject: Show more
Journals Show more
Publishers: Show more
Societies Show more
Series: Show more
Collections: Show more

Actions for selected content:

Select all | Deselect all
  • View selected items
  • Export citations
  • Download PDF (zip)
  • Save to Kindle
  • Save to Dropbox
  • Save to Google Drive

Save Search

You can save your searches here and later view and run them again in "My saved searches".

Please provide a title, maximum of 40 characters.
Cancel
×

1 results

  • Materials for 3D Packaging of Electronic and Optoelectronic Systems

  • Volkan H. Ozguz, James Yamaguchi
  • Journal:
    MRS Bulletin / Volume 28 / Issue 1 / January 2003
    Published online by Cambridge University Press:
    31 January 2011, pp. 35-40
    Print publication:
    January 2003

  • Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages.” Three-dimensional packages require the use of a variety of materials within a small physical size range. Materials selection is therefore critical from electrical, optical, mechanical, structural, thermal, and manufacturability viewpoints. The materials combination depends also on the intended application for the 3D packaged modules. This article reviews 3D packaging approaches, materials classes, and examples. Three-dimensional packaged systems using judiciously selected materials offer performance advantages that cannot be provided by planar implementation.