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Etching and Surface Modification of Polymers in CF4/O2 Plasma Discharges

Published online by Cambridge University Press:  21 February 2011

P. M. Scott ,
S. V. Babu ,
R. E. Partch  and
L. J. Matienzo
P. M. Scott
Affiliation:
Department of Chemical Engg, Clarkson Univ., Potsdam, NY 13676
S. V. Babu
Affiliation:
Department of Chemical Engg, Clarkson Univ., Potsdam, NY 13676
R. E. Partch
Affiliation:
Department of Chemistry, Clarkson Univ., Potsdam, NY 13676
L. J. Matienzo
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, NY 13760
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Abstract

Some results of simultaneous measurement of polyimide etch rates, temperature, and O− and F− atom emission intensities in CF4/O2 plasma discharges are described. Several process variables have been investigated both during steady and unsteady plasma reactor operation. Atomic compositions on the polymer surface have been determined as a function of time of exposure to the plasma using ESCA, and the C IS spectra apalyzed to identify the various C-O and C-F bonds.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 207
Copyright
Copyright © Materials Research Society 1988

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Footnotes

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Current address: IBM Corporation, Owego, NY 13827

References

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