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Materials and Processes for High Functionality Hybrid Circuit Packages

Published online by Cambridge University Press:  21 February 2011

Donald Jaffe
Donald Jaffe*
Affiliation:
AT&T Bell Laboratories, 555 Union Boulevard, Allentown, PA 18103
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Abstract

Materials and processes used for high functionality hybrid circuit packages based on ceramic substrates are described. Emphasis is on hybrid circuits used for telecommunications and related applications. Examples include packages utilizing thin film technology, thick film technology and combinations of the two technologies. Various thick and thin multilayer approaches to achieve high interconnection density are discussed. These employ a variety of metal conducting systems in conjunction with glasses and/or polymeric materials as dielectric insulating layers.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 301
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1.Giffels, C. A. et al, Interconnection Media, AT&T Technical Journal, July/August, 1987, pp. 31–44.Google Scholar
2.Mayo, J. S., Materials for Information and Communication, Scientific American, October, 1986, pp. 59–65.Google Scholar
3.Shiflett, C. C. et al, High-Density Multilayer Hybrid Circuits made with Polymer Insulating Layers (POLYHIC's), Proceedings 1986 ISHM Symposium, Atlanta, GA, October, 1986, pp. 481–486.Google Scholar
4. A History of Engineering and Science in the Bell System, Electronics Technology (1925–1975), F. M. Smits, Editor, Chapter 9.Google Scholar