Heating coils utilize the concept of resistive heating to convert electrical energy into thermal energy. Uniform heating of the target area is the key performance indicator for heating coil design. Highly uniform distribution of temperature can be achieved by using a dense metal distribution in the area under consideration, however, this increases the cost of production significantly. A low-cost and efficient heating coil should have excellent temperature uniformity while having minimum metal consumption. In this work, space-filling fractal curves, such as Peano curve, Hilbert curve and Moore curve of various orders, have been studied as geometries for heating coils. In order to compare them in an effective way, the area of the geometries has been held constant at 30 mm × 30 mm and a constant power of 2 W has been maintained across all the geometries. Further, the thickness of the metal coils and their widths have been kept constant for all geometries. Finite Element Analysis (FEA) results show Hilbert and Moore curves of order-4, and Peano curve of order-3 outperform the typical double-spiral heater in terms of temperature uniformity and metal coil length.

Stretchable electronics fabrication generally relies on fine-tuning adhesion forces, putting some restrictions on what the carrier layer can be. In contrast to adhesion, mechanical tangling makes more kinds of carrier materials available. Antibacterial, conductive, heat-responsive and other functions can be brought in by fiber networks as long as they are compatible with the highly selective silicon etch process. Mechanical grippers can also bring electronic contacts from one side of a mesh to the other, which is difficult to do on continuous thin films of other soft materials like silicone or polyimide. Our solution uses mechanical strain to produce large arrays of redundant grippers from planar thin-film designs.

The patterning of gold and silver micro and nanostructures on rigid and flexible substrates is investigated by microcontact printed thiol based self-assembled monolayers. The aspect ratio of the noble metal micro and nanostructures is determined by interaction of the -SH head group of the CH3(CH2)19SH molecules and the surface of the noble metal. Silver micro and nanostructures with >10 times higher aspect ratios can be realized in comparison to commonly realized gold micro and nanostructures. The printing process is described, and the etching process is characterized in terms of etching window and etching selectivity. Potential electronic and photonic applications of the micro and nanostructures are discussed taking the boundary conditions of the printing process and the selected material system into consideration.

Microsupercapacitors (MSCs) are miniaturized energy storage devices that can be integrated in an on-chip platform as a component of a power supply for Internet of things’ sensors. Integration of these on-chip MSCs require them to be fabricated through CMOS compatible fabrication techniques such as spin coating. One of the biggest challenges in spin coated MSCs is the poor surface adhesion. In this work, we present a CMOS compatible electrode deposition process with enhanced adhesion and retention for reduced graphene oxide (rGO) using spin coating. In order to improve the adhesion and surface uniformity of the deposited electrode material, the surface of Si/SiO2 wafers was subjected to roughening through Fe nanoparticle formation. A 4 nm thick Fe layer deposition substantially magnified the average mean surface roughness of the substrates. In comparison with substrates without the Fe deposition, the treated ones have more than 300% improvement in surface coverage and rGO mass retention after sonication testing. These results suggest that the surface roughening has a positive influence on electrode deposition via a spin-coating method.

In this paper, we studied the temperature dependency effect of thermal coefficient of resistance (TCR) in amorphous silicon (a-Si) on the properties of uncooled microbolometer with a-Si as a resistance layer by simulation. The temperature of the microbolometer rises during the operation mainly due to the heat generated by Joule heating as well as IR radiation. Generally, the TCR of a-Si is treated as a constant for the simplicity but the absolute value of TCR has been reported to decrease as the temperature increases. Therefore, to improve the device characteristics, the effect of temperature dependency of TCR in a-Si should be considered carefully in the range of the operating temperature. The responsivities of microbolometer are simulated according to the width of the resistance layer (W) with TCR as a function of temperature, which shows that the optimal W condition is affected by the TCR value changed by the temperature.

This paper examines the effect of spatial roughness on the dynamical behaviour of electrostatic microactuators. We develop a comprehensive physical model that comprises a nonlinear electrostatic actuation force aswell as a squeeze-film damping term to accurately simulate the dynamical behavior of a cantilever beam actuator. Spatial roughness is modeled as a nonstationary stochastic process whose parameters can be estimated from profilometric measurements. We propagate the stochastic model through the physical system and examine the resulting uncertainty in the dynamical behavior that manifests as a variation in the quality factor of the device. We identify two distinct, yet coupled, modes of uncertainty propagation in the system, that result from the roughness causing variation in the electrostatic actuation force and the damping pressure, respectively. By artificially turning off each of these modes of propagation in sequence, we demonstrate that the variation in the damping pressure has a greater effect on the damping ratio than that arising from the electrostatic force. Comparison with similar simulations performed using a simplified mass-spring-damper model show that the coupling between these two mechanisms can be captured only when the physical model includes the primary nonlinear interactions along with a proper treatment of spatial variations. We also highlight the difference between nonstationary and stationary covariance formulations by showing that the stationary model is unable to properly capture the full range of variation as compared to its nonstationary counterpart.

Engineering, whether in the form of product development or manufacturing processes, often drives the selection or creation of new materials in order to meet performance requirements. Conversely, development of new materials, or new ways to process materials, can lead to new engineering capabilities that, in turn, lead to new products or improved product performance. The interplay between materials and engineering is dynamic, ongoing, and critical to the success of many new products and industries. In this article, we take examples of this interplay from four technology companies in different industries developing widely different materials systems. Each example demonstrates the critical role that materials play in creating new products, new manufacturing methods, and even new design methodologies. Our examples come from polymer microfluidic devices, silicon- and nonsilicon-based microelectromechanical systems, and metals additive manufacturing.

This article reports on the state-of-the-art of the development of aluminum nitride (AlN) thin-film microelectromechanical systems (MEMS) with particular emphasis on acoustic devices for radio frequency (RF) signal processing. Examples of resonant devices are reviewed to highlight the capabilities of AlN as an integrated circuit compatible material for the implementation of RF filters and oscillators. The commercial success of thin-film bulk acoustic resonators is presented to show how AlN has de facto become an industrial standard for the synthesis of high performance duplexers. The article also reports on the development of a new class of AlN acoustic resonators that are directly integrated with circuits and enable a new generation of reconfigurable narrowband filters and oscillators. Research efforts related to the deposition of doped AlN films and the scaling of sputtered AlN films into the nano realm are also provided as examples of possible future material developments that could expand the range of applicability of AlN MEMS.

A new method is proposed to determine the elastic modulus and residual stress of freestanding thin films based on nanoindentation techniques. The experimentally measured stiffness-displacement response is applied to a simple membrane model that assumes the film deformation is dominated by stretching as opposed to bending. Dimensional analysis is used to identify appropriate limitations of the proposed model. Experimental verification of the method is demonstrated for Al/0.5 wt% Cu films nominally 22 µm wide, 0.55 µm thick, and 150, 300, and 500 µm long. The estimated modulus for the four freestanding films match the value measured by electrostatic techniques to within 2%, and the residual stress to within 19.1%. The difference in residual stress can be completely accounted for by thermal expansion and a modest change in temperature of 3 °C. Numerous experimental pitfalls are identified and discussed. Collectively, these data and the technique used to generate them should help future investigators make more accurate and precise measurements of the mechanical properties of freestanding thin films using nanoindentation.

Microfabrication techniques and scale-up by replication promise to transform classical batch-wise chemical laboratory procedures into integrated systems capable of providing new understanding and control of fundamental processes. Such integrated microchemical systems would enable rapid, continuous discovery and development of new products with the use of fewer resources and the generation of less waste. Additional opportunities exist for on-demand and on-site synthesis, with perhaps the first applications emerging in portable energy sources based on the conversion of hydrocarbons to hydrogen for miniaturized fuel cells.

Microchemical systems can be realized in a wide range of materials including stainless steel, glass, ceramics, silicon, and polymers. The high mechanical strength, excellent temperature characteristics, and good chemical compatibility of silicon combined with the existing fabrication infrastructure for microelectromechanical systems (MEMS) offer advantages in fabricating chemical microsystems that are compatible with strong solvents and operate at elevated temperatures and pressures. Furthermore, silicon-based microsensors for flow, pressure, and temperature can readily be integrated into the systems.

Microsystems for broad chemical applications should be discovery tools that can easily be applied by chemists and materials scientists while also having a convincing “scale-out” to at least small production levels. The interplay of both these capabilities is important in making microreaction technology successful. Perhaps the largest impact of microchemical systems will ultimately be the ability to explore reaction conditions and chemistry at conditions that are otherwise difficult to establish in the laboratory. Case studies are selected to illustrate microfluidic applications in which silicon adds advantages, specifically, integration of physical sensors and infrared spectroscopy, highthroughput experimentation in moisture-sensitive organic synthesis, controlled synthesis of nanoparticles (quantum dots), multiphase and heterogeneous catalytic reactions at elevated temperatures and pressures, and thermal management in the conversion of hydrocarbons to hydrogen.

Microelectromechanical systems (MEMS) devices can be delicate structures sensitive to damage from handling or environmental influences. Their functionality may furthermore depend on sealing out the environment or being in direct contact with it. Stress, thermal load, and contaminants may change their characteristics. Here, packaging technology is challenged to extend from microelectronics toward MEMS and optoelectronic MEMS (MOEMS). Today's approaches rely on modified single-chip packages derived from the microelectronics industry, wafer-level capping to enable the device to be packaged like an integrated circuit, or highly specialized packages designed to complement the function of the MEMS device itself. Selecting the proper packaging method may tip the scale toward a product success or a product failure. Choosing the right technology, therefore, is a crucial part of the product design.

Vacuum packaging of high-performance surface-micromachined uncooled microbolometer detectors and focal-plane arrays (FPAs) for infrared imaging and nonimaging applications, inertial MEMS (microelectromechanical systems) accelerometers and gyroscopes, and rf MEMS resonators is a key issue in the technology development path to low-cost, high-volume MEMS production. In this article, two approaches to vacuum packaging for MEMS will be discussed. The first is component-level vacuum packaging, a die-level approach that involves packaging individual die in a ceramic package using either a silicon or germanium lid. The second approach is wafer-level vacuum packaging, in which the vacuum-packaging process is carried out at the wafer level prior to dicing the wafer into individual die. We focus the discussion of MEMS vacuum packaging on surface-micromachined uncooled amorphous silicon infrared microbolometer detectors and FPAs for which both component-level and wafer-level vacuum packaging have found widespread application and system insertion. We first discuss the requirement for vacuum packaging of uncooled a-Si microbolometers and FPAs. Second, we discuss the details of the component-level and wafer-level vacuum-packaging approaches. Finally, we discuss the system insertion of wafer-level vacuum packaging into the Raytheon 2000AS uncooled infrared imaging camera product line that employs a wafer-level-packaged 160 × 120 pixel a-Si infrared FPA.