This paper presents the research done at LAAS-CNRS and in the context of “NANOCOMM” project. This project aims to demonstrate the potential of nanotechnology for the development of reconfigurable, ultra-sensitive, low consumption, and easy installation sensor networks with high performance in terms of reliability in line with the requirements of aeronautics and space. Each node of the sensor network is composed of nano-sensors, transceiver, and planar antenna. In this project, three-dimensional (3D) heterogeneous integration of these different components, on flexible polyimide substrate, is planned. Two types of sensors are selected for this project: strain gauges are used for the structure health monitoring (SHM) application and electrochemical cells are used to demonstrate the ability to detect frost phenomenon. After processing, sensors data are processed and transmitted to the reader unit using an ultra-wide band (UWB) transceiver. (digital baseband and radiofrequency (RF) head). The design and implementation of reconfigurable wireless communication architectures are provided according to the application requirements using nanoscale 65 nm CMOS technology. It is proposed to integrate on flexible substrate the transceiver using the flip-chip technique. A 60 GHz planar antenna is connected to the transceiver for the wireless data transmission. This paper is focused on the 3D integration techniques and the technological process used for the realization of such communicating nano-objects on polyimide substrate. The first assembly tests were carried out. Tests of interconnections quality and electrical contacts (Daisy Chain, calibration kit, etc.) were also performed with good results. A bumps contact resistance of 15 mΩ is measured.