We present a self-biased three-stage GaN-based monolithic microwave integrated circuit low-noise amplifier (LNA) operating between 26 and 29 GHz for 5G mobile communications. The self-biasing circuit, common-source topology with inductive source feedback, and RLC negative feedback loops between gate and drain of the third transistor were implemented to achieve low noise, good port match, high stability, high gain, and compact size. Measurement results show that the LNA has a high and flat gain of 30.5 ± 0.4 dB with noise figure (NF) of 1.65–1.8 dB across the band. The three-stage topology also achieves high linearity, providing the 1 dB compression point output power (P1dB) of 21 dBm in the band. To our knowledge, this combination of NF, gain, and linearity performance represents the state of art of self-biased LNA in this frequency band.

This paper presents the performance study of a 248 GHz voltage-controlled hetero-integrated signal source using indium phosphide (InP)-on-bipolar complementary metal-oxide-semiconductor (BiCMOS) technology. The source consists of a voltage controlled oscillator (VCO) in 0.25 µm BiCMOS technology and a frequency multiplier in 0.8 µm transferred-substrate InP-heterojunction bipolar transistor technology, which is integrated on top of the BiCMOS monolithic microwave integrated circuit in a wafer-level based benzocyclobutene bonding process. The vertical transitions from BiCMOS to InP in this process exhibit broadband properties with insertion losses below 0.5 dB up to 325 GHz. The VCO operates at 82.7 GHz with an output power of 6 dBm and the combined circuit delivers −9 dBm at 248 GHz with 1.22% tuning range. The phase noise of the combined circuit is −85 dBc/Hz at 1 MHz offset. The measured output return loss of the hetero-integrated source is >10 dB within a broad frequency range. This result shows the potential of the hetero integrated process for THz frequencies.

This work presents the design, fabrication, and test of X-band and 2–18 GHz wideband high-power single pole double throw (SPDT) monolithic microwave integrated circuit (MMIC) switches in microstrip gallium nitride (GaN) technology. Such switches have demonstrated state-of-the-art performances and RF fabrication yields better than 65%. In particular, the X-band switch exhibits 1 dB insertion loss, better than 37 dB isolation, and a power handling capability better than 39 dBm at a 1 dB insertion loss compression point; the wideband switch shows an insertion loss lower than 2.2 dB, better than 25 dB isolation, and an insertion loss compression of 1 dB at an input drive higher than 38.5 dBm in the entire bandwidth.