This paper presents a study of losses in substrate-integrated waveguides (SIWs) and cavities. Three mechanisms of losses are considered and separately investigated, namely radiation leakage, ohmic loss, and dielectric loss. A systematic comparison of waveguides with different geometry, operating at different frequencies, is reported. This study permits to give a physical interpretation of the loss mechanisms and to identify design criteria to minimize losses. A similar analysis is also developed in this work for the case of SIW resonant cavities. For these structures, a different variation of losses with respect to frequency is found, which reduces the effectiveness of the design criteria established for SIWs.

This article describes the design and performance of a compact tunable impedance transformer. The structure is based on a transmission line loaded by varactor diodes. Using only two pairs of diodes, the circuit is very small with a total length of only λ/10. Both the frequency range and the load impedance can be tuned by varying the varactor bias voltages. Our design provides a tunable operating frequency range of ±40% and an impedance match ranging from 20 to 90 Ω at 0.8 GHz and from 30 to 170 Ω at 1.5 GHz. In addition, a new approach that considers losses for the simulation and measurement of this impedance transformer was investigated. The measured performance of a 1 GHz prototype design confirmed the validity of this new approach.

Traveling wave amplifiers (TWAs) offer the advantage of broadband amplification and a closed set of equations that allow deriving the RF gain by means of treating TWAs as discrete transmission line approximations. Up to now, however, the significant losses associated with CMOS integrated inductors have been neglected. This work presents a new approach for determining the transmission line losses and phase constants that will bring about an enhanced gain prediction accuracy. The theory is verified by means of a realized design example. The working principle of the integrated DC supply inductor is discussed, whose performance is based on the inductors self-resonance effect. When applying a supply voltage Vdd of 2.4 V, the measured compression point P1 dB and the power added efficiency PAE at 2.4 GHz amount to 16.9 dBm and 19.6%, respectively. At 5.5 GHz, a value of 16.6 dBm for P1 dB and an associated PAE of 13.9% are achieved. The peak RF gain for these output power values reaches 11 dB, and values greater than 8 dB are obtained up to 7 GHz.

Extensive simulation experiments are carried out for the first time, to study the optical modulation of the high- frequency characteristics of III–V GaN-(gallium nitride) based top-mounted and flip-chip IMPact Avalanche Transit Time (IMPATT) oscillators at MM-wave window frequency (140.0 GHz). It is found that the un-illuminated GaN IMPATT is capable of delivering a RF power of 5.6 W with an efficiency of 23.5% at 145.0 GHz. Frequency up-chirping of 6.0 GHz and a degradation of RF power output by almost 15.0% are further observed in case of photo-illuminated FC IMPATT. The study reveals that compared to predominate electron photocurrent in top-mounted IMPATT, photo-generated leakage current dominated by hole in flip-chip IMPATT has more pronounced effect on the GaN-based device as regards the frequency chirping and decrease of negative conductance and total negative resistance per unit area of the device. The inequality in the magnitudes of electron and hole ionization rates in the wide band gap semiconductor has been found to be correlated with the above results. The study reveals that GaN IMPATT is a potential candidate for replacing conventional IMPATTs at high-frequency operation. These results are useful for practical realization of optically controlled GaN-based high-power IMPATTs for application in MM-wave communication systems.

Performance comparison is made between on-chip spiral inductor in flip-chip versus wirebond package technology. Full-wave electromagnetic simulation and on-strip measurement techniques were used to study the performance fluctuations of inductor within flip-chip environment. Results show that the performance of a flipped silicon-based spiral inductor is affected by the radio frequency (RF) current return path differences. The RF current return path for flip-chip is concentrated on the surface of silicon layer exclusively because back side ground under silicon is floating in flip-chip technology. In addition, the bump proximity effect is also considered. On-chip inductors in flip-chip environment must be optimized by reducing the eddy current in the silicon substrate and parasitic affects by adjusting design parameters. The equivalent circuit model of the flipped on-chip spiral inductor is verified with measured results over broadband frequencies. Also, the RF flip-chip characterization technique using on-strip measurement method is presented.

This paper presents the design optimization of circular antenna arrays of isotropic radiators using simulated annealing. The problem has been formulated to achieve a desired value of sidelobe level and a minimum possible value of beamwidth. This is accomplished by jointly optimizing the excitation amplitude and spacing between elements. Simulation examples have been given and comparison has been carried out with particle swarm optimization method.

A 2.4 GHz CMOS blocker filtering low-noise amplifier (BF-LNA) suitable for Bluetooth™ application is presented. The circuit employs a differential amplifier topology with a current mirror active load and a notch filter. Each path amplifies differentially with the common mode input signal, but there is a notch filter rejecting only the wanted signal at one path. By subtracting the two signals from each path, the large interferers are rejected and only the wanted signal is amplified. Therefore, it becomes a narrow-band amplifier with blocker filtering capability, realizing a receiver system without need of the off-chip SAW filter. The BF-LNA is designed using a 0.13-μm CMOS process. The measured performances are a gain of 11.4 dB, and a noise figure of 1.85 dB. Attenuation levels at 400 MHz apart from the target frequency are −13 and −29 dBc at each sideband. The P1dB,in and IIP3 are −8.2 and 1.46 dBm, respectively. The proposed BF-LNA can reject large interferers at the front-end of the receiver system with a good noise figure.