Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T11:28:50.796Z Has data issue: false hasContentIssue false
  • English
  • Français

The Determination of Elastic Constants Using a Combination of X-Ray Stress Techniques

Published online by Cambridge University Press:  06 March 2019

Charles Goldsmith  and
George A. Walker
Charles Goldsmith
Affiliation:
IBM - East Fishkill Facility, Hopewell Junction, NY 12533
George A. Walker
Affiliation:
IBM - East Fishkill Facility, Hopewell Junction, NY 12533
Get access

Abstract

The powder diffraction x-ray technique commonly used to measure strain in polycrystalline materials requires a knowledge of the elastic constants in order to convert the strain into a stress value. For many materials, these constants are not always known. Another technique to measure strain is the x-ray lattice curvature (substrate bending) method which requires no knowledge of the film elastic constants. The strain is measured in the substrate and requires only the elastic constants of the substrate to convert the measured strain into stress. Using a combination of the powder diffraction technique and a double crystal lattice curvature technique, the elastic constants of TaSi2 and WSi2 have been determined for various crystallographic directions.

Type
V. X-Ray Stress Determination, Position Sensitive Detectors, Fatigue and Fracture Characterization
Information
Advances in X-Ray Analysis , Volume 26: Thirty-First Annual Conference on Applications of X-ray Analysis, August 1-6, 1982 , 1982 , pp. 259 - 267
Copyright
Copyright © International Centre for Diffraction Data 1982

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hearn, E. W., Stress measurements in thin films deposited on single crystal substrates through x-ray topography techniques Adv. in X-Ray Anal. 20:273 (1977).Google Scholar
2. Bohg, A., Phys. Stat. Soc. (A) 46:445 (1978).Google Scholar
3. Stoney, G. G., “Proc. Roy. Soc. A” (London), 82:172 (1969).Google Scholar
4. Brantley, W. A., J. Appl. Phys., 44:534 (1968).Google Scholar
5. Lester, H. H. and Aborn, R. H. “Army Ordinance,” 6:120–2, 200–2, 283–2, 364–2 (1925).Google Scholar
6. Marcherauch, E. P., “Expl. Mech.” 6:140 (1966).Google Scholar
7. Cohen, J. B., Dolle, H. and James, K. R., “NBS Special Pub.“ 567–2 (1980).Google Scholar
8. Chrenko, R. H., X-ray residual stress measurements using parallel beam optics, Adv. in X-Ray Anal. 20:393 (1977).Google Scholar
9. Retajczyk, T. F. and Simha, A. K., “Thin Solid Films,” 70:241–2 (1980).Google Scholar
10. Angilello, J., d'Heurle, F., Peterson, S., and Segmuller, A., J. Vac. Sci. lechnol., 17 (1), 1980.Google Scholar
11. Private communication-Northwestern University.Google Scholar