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Highly Sensitive X-Ray Stress Measurement in Small Areas

Published online by Cambridge University Press:  06 March 2019

Nobuyuki Fujii  and
Shigeru Kozaki
Nobuyuki Fujii
Affiliation:
University of Industrial Technology, 4-1-1 Hashimotodai, Sagatnihara, Kanagawa 229, Japan
Shigeru Kozaki
Affiliation:
University of Industrial Technology, 4-1-1 Hashimotodai, Sagatnihara, Kanagawa 229, Japan
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Abstract

The authors tried a new measuring method for stresses in small areas of ceramics. This method is characterized by the following.

  1. 1) Applicable to small areas.

  2. 2) High sensitivity.

  3. 3) Stress calculations by measuring the average Debye ring radius in view of spotty diffraction rings.

  4. 4) The use of an imaging processor for (3).

  5. 5) The use of an imaging plate (IP) for reducing the exposure time.

We worked out a computer simulation about errors of the values measured by our method. The result showed a good approximation. With a test piece applied with a certain load, the difference between stresses measured by our method and those by a strain gauge was about 12 percent. We applied this method to the measurement of residual stresses which took place near the silicon nitride (Si3N4)/304 stainless steel brazing point interface. In the case of using an X-ray beam of 100 μm diameter, the exposure time was 90min with a high sensitive X-ray film and 3min with the imaging plate. In the case of an X-ray beam of 40 μm diameter, it was 120 to 190 min with the imaging plate.

Type
IX. Stress and Strain Determination by Diffraction Methods, Peak Broadening Analysis
Information
Advances in X-Ray Analysis , Volume 36: Forty-First Annual Conference on Applications of X-ray Analysis, August 3-7, 1992 , 1992 , pp. 505 - 513
Copyright
Copyright © International Centre for Diffraction Data 1992

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References

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