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Qualitative Analysis of the Kossel Back Reflection Pattern from Selected Semiconductors

Published online by Cambridge University Press:  06 March 2019

Robert L. Fitzpatrick*
Affiliation:
Motorola Semiconductor Products Division, Phoenix, Arizona 85008
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Abstract

The value of the divergent beam method as a powerful tool for investigating crystal perfection over rather wide limits has been known since the analytical work of K, Lonsdale. This method has been treated experimentally and theoretically by numerous authors and was popularized by Sigmund Weissmann. Although not nearly as useful as the reflection and transmission topographic techniques of Berg-Barrett and Lang for crystal characterization, it is potentially very useful for three dimensional quantitative strain analysis. The “technique phase” as Harvey Yakowitz remarked, is essentially over; however, refinements and optical improvements are certain to evolve if quantitative measurements are to become useful. Very short exposures and the non-destructive nature of the reflection divergent beara - Kossei method is a useful survey tool that has gained limited acceptance.

Presently, the reflection mode is useful in the qualitative survey of numerous semiconductor materials and processes, some of which have been considered from time to time by various authors. A range of crystal perfection, as well as some surface modifications, are surveyed. Kossel reflection pattern artifacts and irregularities are discussed.

Type
Research Article
Copyright
Copyright © International Centre for Diffraction Data 1973

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References

1. Darwin, C. G., “The Theory of X-Ray Reflexion, I & II,” Phil. Mag. 27, 315333, 675-690, (1914).Google Scholar
2. James, R. W., “The Optical Principles of X-Ray Diffraction in Crystals,” London (1950).Google Scholar
3. Patel, J. R., Wagner, R. S. and Moss, S., “X-Ray Investigation of the Perfection of Silicon,Acta Met. 10, 759764 (1962).Google Scholar
4. Carruthers, J. R., Hoffman, R. B. and Ashner, J.D., “X-Ray Investigation of the Perfection of Silicon,J. Appl. Phys. 34, 33883393 (1963).Google Scholar
5. Azaroff, L. V. and L. Bragg, W., “Elements of X-Ray Crystallography,” McGraw Hill, 250251 (1968).Google Scholar
6. Lonsdale, K., “Divergent-Beam X-Ray Photography of Crystals,Phil. Trans. Roy. Soc., London, Ser. A 240, 219250 (1947).Google Scholar
7. Yakowitz, H., “The Divergent Beam Technique,” ADVANCES IN ELECTRONICS AND ELECTRON PHYSICS, Supplement 6, Electron Probe Microanalysis, Ed. Tousimis, A. J. and Marton, L. (1969) Academic Press, Inc. 361431.Google Scholar
8. Geiseler, A. H., Hill, J. K., and Newkirk, J. B., “Divergent Beam X-Ray Photography with Standard Diffraction Equipment,J. Appl. Phys. Vol. 19, 10411049 (1948).Google Scholar
9. Castaing, R. Thesis, University of Paris (1951).Google Scholar
10. Imura, T., “A Study of Deformation of Single Crystals by the Divergent Beam Method,” Part I, II and III, J. Jap. Inst. of Metals, Vol. 16, 10-(1952).Google Scholar
11. Ellis, T., Nanni, L. F., Shrier, A., Weissmann, S., Padawer, G. E., and Hosokawa, N., “Strain and Precision Lattice Parameter Measurements by the X-Ray Divergent Beam Method, I and II,J. Appl. Phy., Vol. 35, 11, 3364 (1964).Google Scholar
12. Yakowitz, H and Vieth, D. L., “Exposure Time Relationings for Kossei Micro Diffraction Photographs,J. of Research NBS Vol. 696, 213216 (1965).Google Scholar
13. Angilello, J., “Large Area X-Ray Back Reflection Technique for Crystal Surface Examination,Norelco Reporter, Vol. XV No. 1, pp. 15, 27 (1968).Google Scholar