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Residual Stress Measurements on Cr/Ni Pads Evaporated on Polyimide Thin Films

Published online by Cambridge University Press:  06 March 2019

C. C. Goldsmith  and
C. Van Buskirk
C. C. Goldsmith
Affiliation:
IBM Corporation, East Fishkill Facility 1580 Rout 52, Hopewell Junciton NY 12533-6531
C. Van Buskirk
Affiliation:
IBM Corporation, East Fishkill Facility 1580 Rout 52, Hopewell Junciton NY 12533-6531
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Abstract

Polyimide films are becoming more important in multi-layer structures, acting as dielectric films to separate conductive layers. High thin film residual stresses can cause problems with the polyimide film, leading to loss of adhesion between the metal film and the polyimide or can cause cracking in the polyimide.

In this paper, we examine the residual stresses in “as deposited” metal films evaporated onto BTDA-APB polyimide films and follow the change in residual stress of the nickel layer during subsequent thermal processing. We will show that the change in residual stresses can be correlated to the glass transition temperature of the polyimide film.

Type
V. X-Ray Characterization of Thin Films
Information
Advances in X-Ray Analysis , Volume 36: Forty-First Annual Conference on Applications of X-ray Analysis, August 3-7, 1992 , 1992 , pp. 203 - 212
Copyright
Copyright © International Centre for Diffraction Data 1992

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References

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