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Static temperature analysis and compensation of MEMSgyroscopes

Published online by Cambridge University Press:  06 March 2014

Q.J. Tang ,
X.J. Wang ,
Q.P. Yang  and
C.Z. Liu
Q.J. Tang
Affiliation:
MOEMS Education Ministry Key Laboratory, Tianjin University, Tianjin 300072, P.R. China School of Engineering and Design, Brunel University, Uxbridge, Middlesex UB8 3PH, UK
X.J. Wang
Affiliation:
MOEMS Education Ministry Key Laboratory, Tianjin University, Tianjin 300072, P.R. China
Q.P. Yang*
Affiliation:
School of Engineering and Design, Brunel University, Uxbridge, Middlesex UB8 3PH, UK
C.Z. Liu
Affiliation:
MOEMS Education Ministry Key Laboratory, Tianjin University, Tianjin 300072, P.R. China
*
⋆ Correspondence:Ping.Yang@brunel.ac.uk
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Abstract

MEMS gyroscopes as a kind of angular rate sensor have been widely used, but theiraccuracy tends to be low in practical applications, especially under temperatureinfluence, and they generally require error compensation. Based on the analysis ofgyroscope operating principle, this paper has shown that the resonant frequency andmeasuring precision of the gyroscope are dependent on temperature and temperaturegradients. The paper has thus proposed a compensation model based on temperature andtemperature gradients. The experimental results have demonstrated that the thermal driftof zero bias can be effectively suppressed, and the accuracy can be improved by one orderof magnitude after compensation. Compared with compensation methods only based ontemperature, the new method gives significantly better performance. The new errorcompensation model has not only integrated the differences under different temperatureconditions, but also reduced the repeatability errors. It provides a theoretical basis foraccurate compensation of the gyroscope thermal error in practical applications and isapplicable to other MEMS gyroscopes.

Keywords

MEMS gyroscopetemperature gradientszero bias compensationtemperature characteristics
Type
Research Article
Information
International Journal of Metrology and Quality Engineering , Volume 4 , Issue 3 , 2013 , pp. 209 - 214
Copyright
© EDP Sciences 2014

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