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Analysis and experimental studies of compact polarization tracking modules for Ku band phased array antennas

Published online by Cambridge University Press:  02 July 2013

Wei Shi*
Affiliation:
Institute of Communication Engineering, PLA University of Science and Technology, Nanjing, 210016, China. Phone: +86 13851548361 Nanjing Telecommunication Technology Institute, Nanjing, 210007, China
Jun Zhou
Affiliation:
State Key Laboratory of Millimeter Waves, Southeast University, Nanjing, 210096, China Nanjing Electronic Device Institute, Nanjing, 210016, China
Zuping Qian
Affiliation:
Institute of Communication Engineering, PLA University of Science and Technology, Nanjing, 210016, China. Phone: +86 13851548361
Ya Shen
Affiliation:
Nanjing Electronic Device Institute, Nanjing, 210016, China
*
Corresponding author: W. Shi Email: sw_ant@sina.com

Abstract

Detailed analysis of the polarization tracking modules for Ku band active phased array antennas is presented. The proposed transmitter (14.0–14.5 GHz) and receiver (12.25–12.75 GHz) modules are based on the low temperature co-fired ceramic (LTCC) technique, containing orthogonal dual channels with different phases controlled by phase shifters. The effect of amplitude and phase inconsistency between two channels on polarization tracking performance is analyzed. The validity of the analysis is verified by the measurements of the manufactured prototypes. The measured patterns of the active phased array antenna are given to illustrate the effects of the modules on polarization agility, which may be used for Ku band satellite antennas on mobile terminals.

Type
Research Papers
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013 

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References

REFERENCES

[1]Adler, C.O.; Monk, A.D.; Rasmussen, D.N.; Taylor, M.J.: Two-way airborne broadband communications using phased array antennas, in IEEE Aerospace Conf., Big Sky, USA, March 2003.Google Scholar
[2]Vaccaro, S.; Llorens del Rio, D.; Sánchez, R.T.; Baggen, R.: Low cost phased array for mobile Ku band satellite terminal, in 4th European Conf. on Antennas and Propagation(EuCAP 2010), Barcelona, Spain, April 2010.Google Scholar
[3]van der Bent, G.; de Boer, T.S.; van Dijk, R.; van der Graaf, M.W.; de Hek, A.P.; van Vliet, F.E.: X-band phase-shifting dual-output balanced amplifier MMIC, in 39th European Microwave Conf., Rome, Italy, September 2009.Google Scholar
[4]Kyutae, L. et al. : RF-system-on-package (SOP) for wireless communications. IEEE Microw. Mag., 3 (2002), 8899.CrossRefGoogle Scholar
[5]Wi, S.H. et al. : Package-level integrated LTCC antenna for RF package application. IEEE Trans. Adv. Packag., 2 (2007), 132141.CrossRefGoogle Scholar
[6]Wi, S.H.; Zhang, Y.P.; Kim, H.; Oh, I.Y.; Yook, J.G.: Integration of antenna and feeding network for compact UWB transceiver package. IEEE Trans. Compon. Packag. Manuf. Technol., 1 (2011), 111118.Google Scholar
[7]Li, R.L. et al. : Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless application. IEEE Trans. Adv. Package, 11 (2004), 581589.Google Scholar
[8]Lee, J.H. et al. : Highly Integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology. IEEE Trans. Microw. Theory Tech., 6 (2005), 22202229.Google Scholar
[9]Kam, D.G.; Liu, D.X.; Natarajan, A.; Reynolds, S.; Chen, H.C.; Floyd, B.A.: LTCC packages with embedded phased-array antennas for 60 GHz communications. IEEE Microw. Wirel. Compon. Lett., 3 (2011), 142144.Google Scholar
[10]Stark, A. et al. : SANTANA: advanced electronically steerable antennas at Ka-band, in 3rd European conf. on Antennas and Propagation, Berlin, Germany, March 2009.Google Scholar
[11]Bara, T., Jacob, A.F.: Advanced broadband 2nd-level-interconnects for LTCC multi-chip-modules, in German Microwave Conf.(GeMiC2005), Ulm, Germany, April 2005.Google Scholar
[12]Abbosh, A.M.: Ultra wideband vertical microstrip–microstrip transition. IET Microw. Antennas Propag., 10 (2007), 968972.Google Scholar
[13]Tsai, C.C.; Cheng, Y.S.; Huang, T.Y.; Hsu, Y.A.; Wu, R.B.: Design of microstrip-to-microstrip via transition in multilayered LTCC for frequencies up to 67 GHz. IEEE Trans. Compon. Packag. Technol., 4 (2011), 595601.Google Scholar
[14]Zhou, J.; Shi, W.; Dou, W.B.; Shen, Y.: High integrated microwave architecture using LTCC-SIP technology in active phased array antenna applications. Frequenz, 6 (2012), 177182.Google Scholar
[15]Lee, Y.C.; Park, C.S.: A system-in-package (SiP) integration of a 62GHz transmitter for MM-wave communication terminals applications. J. Semicond. Technol.Sci., 3 (2004), 182188.Google Scholar