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Broadband capacitively grounded coplanar to coupled microstrip transition for planar microwave photonic components

Published online by Cambridge University Press:  09 September 2016

Massinissa Hadjloum ,
Mohammed El Gibari ,
Hongwu Li  and
Afshin S. Daryoush
Massinissa Hadjloum*
Affiliation:
Lunam Université, Université de Nantes, UMR CNRS 6164: Institut d'Electronique et de Télécommunications de Rennes, Faculté des Sciences et Techniques, 2 Chemin de la Houssinière, BP 92208, 44322 Nantes cedex 3, France. Phone: 00 33 251125535
Mohammed El Gibari
Affiliation:
Lunam Université, Université de Nantes, UMR CNRS 6164: Institut d'Electronique et de Télécommunications de Rennes, Faculté des Sciences et Techniques, 2 Chemin de la Houssinière, BP 92208, 44322 Nantes cedex 3, France. Phone: 00 33 251125535
Hongwu Li
Affiliation:
Lunam Université, Université de Nantes, UMR CNRS 6164: Institut d'Electronique et de Télécommunications de Rennes, Faculté des Sciences et Techniques, 2 Chemin de la Houssinière, BP 92208, 44322 Nantes cedex 3, France. Phone: 00 33 251125535
Afshin S. Daryoush
Affiliation:
Department of ECE, Drexel University, Philadelphia, PA 19104, USA
*
Corresponding author: M. Hadjloum Email: massinissa.hadjloum@univ-nantes.fr
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Abstract

Broadband transitions are presented in this paper for capacitively grounded coplanar waveguide to coupled microstrip (CMS) lines. These transitions are realized on both thick Rogers RO3003 substrate (thickness of 10 mils) and a thin benzocyclobutene (BCB) polymer film (thickness of 20 µm). A flat bandwidth of 4–20 GHz and 3.2 to over 40 GHz are measured for the RO3003 and BCB polymer substrates, respectively. These performances are obtained without making via-hole in the substrate or patterning the bottom ground plane, which makes this broadband transition easier to fabricate compared with the via-hole-based grounded CPW–CMS transitions.

Keywords

CGCPW–CMS transitionBack-to-Back transitionMicrowave photonic componentsPolymerThin films
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 9 , Issue 4 , May 2017 , pp. 815 - 819
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2016 

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References

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