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Integrated 79 GHz UWB automotive radar front-end based on Hi-Mission MCM-D silicon platform

Published online by Cambridge University Press:  07 July 2010

Duncan Platt*
Affiliation:
Acreo Microelectronics Group, Bredgatan 34, 60221 Norrköping, Sweden.
Lars Pettersson
Affiliation:
Acreo Microelectronics Group, Bredgatan 34, 60221 Norrköping, Sweden.
Darius Jakonis
Affiliation:
Acreo Microelectronics Group, Bredgatan 34, 60221 Norrköping, Sweden.
Michael Salter
Affiliation:
Acreo Microelectronics Group, Bredgatan 34, 60221 Norrköping, Sweden.
Joacim Haglund
Affiliation:
Acreo Microelectronics Group, Bredgatan 34, 60221 Norrköping, Sweden.
*
Corresponding author: D. Platt Email: duncan.platt@acreo.se

Abstract

A highly integrated silicon platform (Hi-Mission) for high frequency applications is introduced. This platform utilizes heterogeneous Multi-Chip Module-Deposited (MCM-D) technology with integrated passive devices together with silicon and GaAs Monolithic Microwave Integrated Circuit (MMIC) technology developed for the automotive Ultra Wide Band (UWB) radar (short-range radar) frequency band from 77 to 81 GHz. Developments are described in the area of MCM-D process development, MMIC, integrated phased array antenna, module design, and assembly process development. The demonstrator is composed of two test vehicles designed for conducted and radiated measurements, respectively. Test results are presented at the component and module level.

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010

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References

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