Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-26T07:27:46.284Z Has data issue: false hasContentIssue false

Optimization of InP DHBT stacked-transistors for millimeter-wave power amplifiers

Published online by Cambridge University Press:  07 August 2018

Michele Squartecchia
Affiliation:
Department of Electrical Engineering, Technical University of Denmark, 2800 Kongens Lyngby, Denmark
Tom K. Johansen*
Affiliation:
Department of Electrical Engineering, Technical University of Denmark, 2800 Kongens Lyngby, Denmark
Jean-Yves Dupuy
Affiliation:
III-V Lab (joint lab of Nokia Bell Labs, Thales, and CEA-Leti), 91767 Palaiseau, France
Virginio Midili
Affiliation:
Department of Electrical Engineering, Technical University of Denmark, 2800 Kongens Lyngby, Denmark
Virginie Nodjiadjim
Affiliation:
III-V Lab (joint lab of Nokia Bell Labs, Thales, and CEA-Leti), 91767 Palaiseau, France
Muriel Riet
Affiliation:
III-V Lab (joint lab of Nokia Bell Labs, Thales, and CEA-Leti), 91767 Palaiseau, France
Agnieszka Konczykowska
Affiliation:
III-V Lab (joint lab of Nokia Bell Labs, Thales, and CEA-Leti), 91767 Palaiseau, France
*
Author for correspondence: Tom K. Johansen E-mail: tkj@elektro.dtu.dk

Abstract

In this paper, we report the analysis, design, and implementation of stacked transistors for power amplifiers realized on InP Double Heterojunction Bipolar Transistors (DHBTs) technology. A theoretical analysis based on the interstage matching between all the single transistors has been developed starting from the small-signal equivalent circuit. The analysis has been extended by including large-signal effects and layout-related limitations. An evaluation of the maximum number of transistors for positive incremental power and gain is also carried out. To validate the analysis, E-band three- and four-stacked InP DHBT matched power cells have been realized for the first time as monolithic microwave integrated circuits (MMICs). For the three-stacked transistor, a small-signal gain of 8.3 dB, a saturated output power of 15 dBm, and a peak power added efficiency (PAE) of 5.2% have been obtained at 81 GHz. At the same frequency, the four-stacked transistor achieves a small-signal gain of 11.5 dB, a saturated output power of 14.9 dBm and a peak PAE of 3.8%. A four-way combined three-stacked MMIC power amplifier has been implemented as well. It exhibits a linear gain of 8.1 dB, a saturated output power higher than 18 dBm, and a PAE higher than 3% at 84 GHz.

Type
Research Papers
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Scavennec, A, Sokolich, M and Baeyens, Y (2009) Semiconductor technologies for higher frequencies. IEEE Microwave Magazine 2, 7787.Google Scholar
2Johnson, EO (1965) Physical limitations on frequency and power parameters of transistors. IRE International Convention Record 13, 2734.Google Scholar
3Shifrin, M, Ayasli, Y and Katzin, P (1992) A new power amplifier topology with series biasing and power combining of transistors. IEEE Microwave and Millimeter-wave Monolithic Circuits Symposium Digest, pp. 3941.Google Scholar
4Jeong, J, Pornpromlikit, S, Asbeck, PM and Kelly, D (2006) A 20 dBm linear RF power amplifier using stacked silicon-on-sapphire MOSFETs. IEEE Microwave and Wireless Components Letters 16, 684686.Google Scholar
5Pornpromlikit, S, Jeong, J, Presti, CD, Scuderi, A and Asbeck, PM (2010) A Watt-level stacked-FET linear power amplifier in silicon-on-insulator CMOS. IEEE Transactions on Microwave Theory and Techniques 58, 5764.Google Scholar
6Lee, C, Kim, Y, Koh, Y, Kim, J, Seo, K, Jeong, J and Kwon, Y (2009) A 18 GHz broadband stacked FET power amplifier using 130 nm metamorphic HEMTs. IEEE Microwave and Wireless Components Letters 19, 828830.Google Scholar
7Fritsche, D, Wolf, R and Ellinger, F (2012) Analysis and design of a stacked power amplifier with very high bandwidth. IEEE Transactions on Microwave Theory and Techniques 60, 32233231.Google Scholar
8Ezzeddine, AK, Huang, HC and Singer, JL (2011) UHiFET – a new high-frequency high-voltage device. IEEE MTT-S International Microwave Symposium.Google Scholar
9Wu, HF, Cheng, QF, Li, XG and Fu, HP (2016) Analysis and design of an ultrabroadband stacked power amplifier in CMOS technology. IEEE Trans. Circuits and systems II: Express Briefs 63, 4953.Google Scholar
10Dabag, HT, Hanafi, B, Golcuk, F, Agah, A, Buckwalter, JF and Asbeck, PM (2013) Analysis and design of stacked-FET millimeter-wave power amplifiers. IEEE Transactions on Microwave Theory and Techniques 61, 15431556.Google Scholar
11Agah, A, Jayamon, JA, Asbeck, PM, Larson, LE and Buckwalter, JF (2014) Multi-drive stacked-FET power amplifiers at 90 GHz in 45 nm SOI CMOS. IEEE Journal of Solid-State Circuits 49, 11481157.Google Scholar
12Chakrabarti, A and Krishnaswamy, H (2014) High-power high-efficiency class-E-like stacked mmWave PAs in SOI and Bulk CMOS: theory and implementation. IEEE Transactions on Microwave Theory and Techniques 62, 16861704.Google Scholar
13Kim, Y and Kwon, Y (2015) Analysis and design of millimeter-wave power amplifier using stacked-FET structure. IEEE Transactions on Microwave Theory and Techniques 63, 691702.Google Scholar
14Gavell, M, Angelov, I, Ferndahl, M and Zirath, H (2015) A high voltage mm-wave stacked HEMT power amplifier in 0.1 μm InGaAs technology. IEEE MTT-S International Microwave Symposium.Google Scholar
15Datta, K and Hashemi, H (2017) High-breakdown, high-f max multiport stacked-transistor topologies for the W-Band power amplifiers. IEEE Journal of Solid-State Circuits 52, 13051319.Google Scholar
16Johansen, TK, Yan, L, Dupuy, JY, Nodjiadjim, V, Konczykowska, A and Riet, M (2013) Millimeter-wave InP DHBT power amplifier based on power-optimized cascode configuration. Microwave and Optical Technology Letters 55, 11781182.Google Scholar
17Yan, L and Johansen, TK (2013) Design of InP DHBT power amplifiers at millimeter-wave frequencies using interstage matched cascode technique. Microelectronics Journal 44, 12311237.Google Scholar
18Squartecchia, M, Midili, V, Johansen, TK, Dupuy, JY, Nodjiadjim, V, Riet, M and Konczykowska, A (2017) 75 GHz InP DHBT power amplifier based on two-stacked transistors. Asia Pacific Microwave Conference (APMC), Kuala Lumpur.Google Scholar
19Hadziabdic, D, Krozer, V and Johansen, TK (2008) Power amplifier design for E-band wireless system communications. 38th European Microwave Conference (EuMC), Amsterdam.Google Scholar
20Griffith, Z, Urteaga, M, Rowell, P and Pierson, R (2015) 340–440 mW broadband, high-efficiency E-band PA's in InP HBT. IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).Google Scholar
21Urteaga, M, Griffith, Z, Seo, M, Hacker, J and Rodwell, MJW (2017) InP HBT technologies for THz integrated circuits. Proceedings of the IEEE 105, 10511067.Google Scholar
22Kassim, S and Malek, F (2010) EM/circuit co-simulation: a highly accurate method for microwave amplifier design. Universal Journal of Computer Science and Engineering Technology 2, 127132.Google Scholar
23Thompson, M and Moore, J (2015) Challenges and methodologies in EM simulation with circuit models. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).Google Scholar
24Johansen, TK, Leblanc, R, Poulain, J and Delmouly, V (2016) Direct extraction of InP/GaAsSb/InP DHBT equivalent-circuit elements from S-parameters measured at cut-off and normal bias conditions. IEEE Transactions on Microwave Theory and Techniques 64, 115124.Google Scholar
25Johansen, TK, Midili, V, Squartecchia, M, Zhurbenko, V, Nodjiadjim, V, Dupuy, JY, Riet, M and Konczykowska, A (2017) Large-signal modeling of multi-finger InP DHBT devices at millimeter-wave frequencies. International Workshop on Integrated Nonlinear Microwave and Millimeter-Wave Circuits (INMMiC), Graz.Google Scholar
26Green, JE, Tozer, RC and David, JPR (2013) Stability in small signal common base amplifiers. IEEE Transactions on Circuits and Systems-I: Regular Papers 60, 846855.Google Scholar