Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-26T08:39:03.010Z Has data issue: false hasContentIssue false

A streamlined drain-lag model for GaN HEMTs based on pulsed S-parameter measurements

Published online by Cambridge University Press:  22 February 2019

Peng Luo*
Affiliation:
Brandenburgische Technische Universität Cottbus-Senftenberg, 03046 Cottbus, Germany Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
Frank Schnieder
Affiliation:
Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
Olof Bengtsson
Affiliation:
Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
Valeria Vadalà
Affiliation:
Department of Engineering, University of Ferrara, 44122 Ferrara, Italy
Antonio Raffo
Affiliation:
Department of Engineering, University of Ferrara, 44122 Ferrara, Italy
Wolfgang Heinrich
Affiliation:
Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
Matthias Rudolph
Affiliation:
Brandenburgische Technische Universität Cottbus-Senftenberg, 03046 Cottbus, Germany Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, 12489 Berlin, Germany
*
Author for correspondence: Peng Luo, E-mail: Peng.Luo@b-tu.de

Abstract

Accurately and efficiently modeling the drain-lag effects is crucial in nonlinear large-signal modeling for Gallium Nitride high electron mobility transistors. In this paper, a simplified yet accurate drain-lag model based on an industry standard large-signal model, i.e., the Chalmers (Angelov) model, extracted by means of pulsed S-parameter measurements, is presented. Instead of a complex nonlinear drain-lag description, only four constant parameters of the proposed drain-lag model need to be determined to accurately describe the large impacts of the drain-lag effects, e.g., drain-source current slump, typical kink observed in pulsed IV curves, and degradation of the output power. The extraction procedure of the parameters is based on pulsed S-parameter measurements, which allow to freeze traps and isolate the trapping effects from self-heating. It is also shown that the model can very accurately predict the load pull performance over a wide range of drain bias voltages. Finally, the large-signal network analyzer measurements at low frequency are used to further verify the proposed drain-lag model in the prediction of the output current in time domain under large-signal condition.

Type
Research Papers
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2019 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Rudolph, M, Fager, C and Root, DE (2011) Nonlinear Transistor Model Parameter Extraction Techniques. Cambridge, UK: Cambridge University Press.Google Scholar
2Binari, SC, Klein, PB and Kazior, TE (2002) Trapping effects in GaN and SiC microwave FETs. Proceedings of the IEEE 90, 10481058.Google Scholar
3Luo, P, Bengtsson, O and Rudolph, M (2017) A Drain-Lag Model for GaN HEMT based on Chalmers model and pulsed S-Parameter measurements, in IEEE MTT-S IMS Dig., Honolulu, USA.Google Scholar
4Jarndal, A and Kompa, G (2007) Large-signal model for AlGaN/GaN HEMTs accurately predicts trapping- and self-heating-induced dispersion and intermodulation distortion. IEEE Transactions on Electron Devices 54, 28302836.Google Scholar
5Yuk, KS, Branner, GR and McQuate, DJ (2009) A wideband multiharmonic empirical large-signal model for high-power GaN HEMTs with self-heating and charge-trapping effects. IEEE Transactions on Microwave Theory and Techniques 57, 33223332.Google Scholar
6Raffo, A, Vadalà, V, Schreurs, P, Crupi, G, Avolio, G, Caddemi, A and Vannini, G (2010) Nonlinear dispersive modeling of electron devices oriented to GaN power amplifier design. IEEE Transactions on Microwave Theory and Techniques 58, 710718.Google Scholar
7King, JB and Brazil, T (2013) Nonlinear electrothermal GaN HEMT model applied to high-efficiency power amplifier design. IEEE Transactions on Microwave Theory and Techniques 61, 444454.Google Scholar
8Jardel, O, Groote, F, Reveyrand, T, Jacquet, J, Charbonniaud, C, Teyssier, JP, Floriot, D and Quéré, R (2007) An electrothermal model for AlGaN/GaN power HEMTs including trapping effects to improve large-signal simulation results on high VSWR. IEEE Transactions on Microwave Theory and Techniques 55, 26602669.Google Scholar
9Chevtchenko, SA, Kurpas, P, Chaturvedi, N, Lossy, R and Wurfl, J (2011) Investigation and reduction of leakage current associated with gate encapsulation by SiNx in AlGaN/GaN HFETs, in CS MANTECH Conf. Dig., California, USA.Google Scholar
10Angelov, I, Bengtsson, L and Garcia, M (1996) Extension of the Chalmers nonlinear HEMT and MESFET model. IEEE Transactions on Microwave Theory and Techniques 44, 16641674.Google Scholar
11Angelov, I, Desmaris, V, Dynefors, K, Nilsson, PA, Rorsman, N and Zirath, H (2005) On the large-signal modeling of AlGaN/GaN HEMTs and SiC MESFETs, in Proceeding of the 13th GaAs Symposium, Paris, France.Google Scholar
12Dambrine, G, Cappy, A, Heliodore, F and Playez, E (1988) A new method for determining the fet small-signal equivalent circuit. IEEE Transactions on Microwave Theory and Techniques 36, 11511159.Google Scholar
13Luo, P, Bengtsson, O and Rudolph, M (2016) Reliable GaN HEMT modeling based on Chalmers model and pulsed S-Parameter measurements in German Microwave Conference (GeMiC), Bochum, Germany.Google Scholar
14Jenkins, KA and Rim, K (2002) Measurement of the effect of self-heating in strained-silicon MOSFETs. IEEE Electron Device Letters 23, 360362.Google Scholar
15Camacho-Peñalosa, C and Aitchison, CS (1985) Modelling frequency dependence of output impedance of a microwave MESFET at low frequencies. Electronics Letters 21, 528529.Google Scholar
16Luo, P, Bengtsson, O and Rudolph, M (2016) A novel approach to trapping effect based on Chalmers model and pulsed S-Parameter measurements, in European Microwave Integrated Circuits Conference (EuMIC), London, UK.Google Scholar
17Nunes, LC, Gomes, JL, Cabral, PM and Pedro, JC (2018) A simple method to extract trapping time constants of GaN HEMTs, in IEEE MTT-S IMS Dig., Philadelphia, USA.Google Scholar
18Huang, A-D, Zhong, Z, Wu, W and Guo, Y-X (2016) An artificial neural network-based electrothermal model for GaN HEMTs with dynamic trapping effects consideration. IEEE Transactions on Microwave Theory and Techniques 64, 25192528.Google Scholar
19Jarndal, A, Markos, AZ and Kompa, G (2011) Improved modeling of GaN HEMTs on Si substrate for design of RF power amplifiers. IEEE Transactions on Microwave Theory and Techniques 59, 644651.Google Scholar
20Advanced Design System (ADS) (2015) Keysight Technologies, Inc., Santa Rosa, CA, United States.Google Scholar
21Rudolph, M, Doerner, R, Ngnintedem, E and Heinrich, W (2012) Noise modeling of GaN HEMT devices, in European Microwave Integrated Circuits Conference (EuMIC), Amsterdam, The Netherlands.Google Scholar
22Crupi, G, Raffo, A, Caddemi, A and Vannini, G (2015) Kink effect in S22 for GaN and GaAs HEMTs. IEEE Microwave and Wireless Components Letters 25, 301303.Google Scholar
23Raffo, A, Di Falco, S, Vadalà, V and Vannini, G (2010) Characterization of GaN HEMT low-frequency dispersion through a multiharmonic measurement system. IEEE Transactions on Microwave Theory and Techniques 58, 24902496.Google Scholar