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250 °C isothermal section of ternary Sn-In-Cu phase equilibria

Published online by Cambridge University Press:  31 January 2011

Shih-kang Lin ,
Ting-ying Chung ,
Sinn-wen Chen  and
Chih-horng Chang
Sinn-wen Chen*
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-chu 300, Taiwan
Chih-horng Chang
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-chu 300, Taiwan
*
a) Address all correspondence to this author. e-mail: swchen@mx.nthu.edu.tw
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Abstract

Ternary Sn-In-Cu alloys are prepared and equilibrated at 250 °C for 2 to 20 weeks. The phases formed in these alloys are experimentally determined. The 250 °C Sn-In-Cu isothermal section is established according to the phase equilibrium information obtained in this study and that of the three constituent binary systems. It has eight single-phase regions, namely liquid, δ1-Cu41Sn11, ε-Cu3Sn, δ2-Cu7In3, η-(Cu6Sn5, Cu2In), Cu11In9, Cu2In3Sn, and α-(Cu) phases, 14 two-phase regions, and seven three-phase regions. In the Sn-In-Cu system at 250 °C, the η-Cu6Sn5 and η-Cu2In phases form a continuous solid solution and the ternary Cu2In3Sn compound is observed. The δ1-Cu41Sn11 phase is stabilized at 250 °C with the introduction of indium although it transforms into α-(Cu) and ε-Cu3Sn phases via a eutectoid reaction around 350 °C in the binary Sn-Cu system. Except for the Cu11In9 phase and the Cu2In3Sn ternary compound, the other binary compounds all have significant indium and tin mutual solubilities.

Keywords

AlloyPhase equilibriaSoldering
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 8 , August 2009 , pp. 2628 - 2637
Copyright
Copyright © Materials Research Society 2009

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References

1Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 (2000).CrossRefGoogle Scholar
2Suganuma, K.: Advances in lead-free electronics soldering. Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).CrossRefGoogle Scholar
3Chen, S W., Wang, C H., Lin, S K., and Chiu, C N.: Phase diagrams of Pb-free solders and their related materials systems. J. Mater. Sci.—Mater. Electron. 18, 1 (2007).Google Scholar
4White, C.E.T. and Okamoto, H.: Phase Diagrams of Indium Alloys and Their Engineering Applications (ASM International, Materials Park, OH, 1992), p. 255.Google Scholar
5Mei, Z. and Morris, J.W.: Superplastic creep of low melting-point solder joints. J. Electron. Mater. 21, 401 (1992).CrossRefGoogle Scholar
6Shimizu, K., Nakanishi, T., Karasawa, K., Hashimoto, K., and Niwa, K.: Solder joint reliability of indium-alloy interconnection. J. Electron. Mater. 24, 39 (1995).CrossRefGoogle Scholar
7Köster, W., Gödecke, T., and Heine, D.: Constitution of copperindium-tin system in range from 100 to 50 at.% Cu. Z. Metallkd. 63, 802 (1972).Google Scholar
8Liu, X.J., Liu, H.S., Ohnuma, I., Kainuma, R., Ishida, K., Itabashi, S., Kameda, H., and Yamaguchi, K.: Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system. J. Electron. Mater. 30, 1093 (2001).CrossRefGoogle Scholar
9Chen, S W., Lin, S K., and Yang, C F.: Interfacial reactions in the Pb-free composite solders with indium layers. J. Electron. Mater. 35, 72 (2006).CrossRefGoogle Scholar
10Lin, S K. and Chen, S W.: Interfacial reactions in the Sn-20at.%In/Cu and Sn-20at. %In/Ni couples at 160 °C. J. Mater. Res. 21, 1712 (2006).CrossRefGoogle Scholar
11Chen, S W. and Lin, S K.: Electric current-induced abnormal Cu/g-InSn4 interfacial reactions. J. Mater. Res. 21, 3065 (2006).CrossRefGoogle Scholar
12Lin, S K., Yang, C F., Wu, S H., and Chen, S W.: Liquidus projection and solidification of the Sn-In-Cu ternary alloys. J. Electron. Mater. 37, 498 (2008).CrossRefGoogle Scholar
13Bahari, Z., Dichi, E., Legendre, B., and Dugue, J.: The equilibrium phase diagram of the copper-indium system: A new investigation. Thermochim. Acta 401, 131 (2003).CrossRefGoogle Scholar
14Saunders, N. and Miodownik, A.P.: Bulletin of Alloy Phase Diagrams, Vol. 11 (ASM International, Materials Park, OH, 1990), p. 278.Google Scholar
15Gangulee, A., Das, G.C., and Bever, M.B.: X-ray-diffraction and calorimetric investigation of compound Cu6Sn5. Metall. Trans. 4, 2063 (1973).CrossRefGoogle Scholar
16Elding-Ponten, M., Stenberg, L., and Lidin, S.: The Z-phase field of the Cu-In system. J. Alloys Compd. 261, 162 (1997).CrossRefGoogle Scholar
17Subramanian, P.R. and Laughlin, D.E.: Bulletin of Alloy Phase Diagrams, Vol. 10 (ASM International, Materials Park, OH, 1989), p. 554.Google Scholar
18Larsson, A-K., Stenberg, L., and Lidin, S.: The superstructure of domain-twinned Z0-Cu6Sn5. Acta Crystallogr., Sect. B: Struct. Sci. 50, 636 (1994).Google Scholar
19Owen, E.A. and Iball, J.: X-ray investigation of certain copper-tin alloys. J. Inst. Metals 57, 267 (1935).Google Scholar
20Owen, E.A. and Williams, E.C.: Further study of copper-tin alloy by x-ray analysis. J. Inst. Metals 58, 283 (1936).Google Scholar
21Wang, C.C. and Hansen, M.: Eutectoid decomposition of the d-phase of the copper-tin system. Trans. Am. Inst. Min. Met. Eng. 191, 1212 (1951).Google Scholar
22Hansen, M.: Constitution of Binary Alloys, 2nd ed. (McGraw-Hill, New York, 1958), pp. 633–638.Google Scholar
23Bolcavage, A., Chen, S W., Kao, C.R., and Chang, Y.A.: Phase equilibria of the Cu-In system I: Experimental investigation. J. Phase Equilib. 14, 14 (1993).CrossRefGoogle Scholar
24Dinsdale, A., Watson, A., Kroupa, A., Vrestal, J., Zemanova, A., and Vizdal, J.: Compiled Atlas of Phase Diagrams for Lead-Free Soldering (COST Office, Czech Republic, 2008), pp. 247–258.Google Scholar