Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-27T23:31:33.932Z Has data issue: false hasContentIssue false

Contact Area Evolution During an Indentation Process

Published online by Cambridge University Press:  31 January 2011

Kangjie Li
Affiliation:
Materials Science Program, Department of Mechanical Engineering, University of Rochester, Rochester, New York 14627
T. W. Wu
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, California 95120
J. C. M. Li
Affiliation:
Materials Science Program, Department of Mechanical Engineering, University of Rochester, Rochester, New York 14627
Get access

Abstract

The evolution of the contact area during an indentation process has been xamined by an ac technique and also by finite element analysis on five mechanically different materials. Constant contact area regimes were observed during the initial unloading stage and the duration of that regime depends strongly on material properties. The consistency of the results obtained by the two approaches not only proves the validity and advantage of the ac indentation technique but also confirms the applicability of contact stiffness equation. The influence of a hardness impression on unloading characteristics has also been clearly demonstrated by numerically simulating a reloading process.

Type
Articles
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Frolich, F., Grau, P., and Grellmann, W., Phys. Status Solidi (a) 42, 7989 (1977).CrossRefGoogle Scholar
2.Newey, D., Wilkins, M. A., and Pollock, H. M., J. Phys. E: Sci. Instrum. 15, 119122 (1982).CrossRefGoogle Scholar
3.Pethica, J., Hutchings, R., and Oliver, W. C., Philos. Mag. A 48, 593 (1983).CrossRefGoogle Scholar
4.Sneddon, I. N., Int. J. Eng. Sci. 3, 4757 (1965).CrossRefGoogle Scholar
5.Pharr, G. M., Oliver, W. C., and Brotzen, F. R., J. Mater. Res. 7, 613617 (1992).CrossRefGoogle Scholar
6.King, R. B., Int. J. Solids Struct. 3, 1657 (1987).CrossRefGoogle Scholar
7.Bulychev, S. I., Alekhin, V. P., Shorshorov, M. Kh., Ternovskii, A. P., and Shnyrev, G. D., Zavod. Lab. 41, 1137 (1975).Google Scholar
8.Doerner, M. F. and Nix, W. D., J. Mater. Res. 1, 601609 (1986).CrossRefGoogle Scholar
9.Oliver, W. C. and Pharr, G. M., J. Mater. Res. 7, 15641583 (1992).CrossRefGoogle Scholar
10.Laursen, T. A. and Simo, J. C., J. Mater. Res. 7, 618626 (1992).CrossRefGoogle Scholar
11.Pethica, J. B. and Oliver, W. C., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 1323.Google Scholar
12.Wu, T. W., Mater. Chem. Phys. 33, 1530 (1993).CrossRefGoogle Scholar
13.Wu, T. W., J. Mater. Res. 6, 407426 (1991).CrossRefGoogle Scholar
14.Bolshakov, A. and Pharr, G. M., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W. W., Gao, H., J-E., Sundgren, and Baker, S. P. (Mater. Res. Soc. Symp. Proc. 146, Pittsburgh, PA, 1996).Google Scholar