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The cracking and decohesion of thin films

Published online by Cambridge University Press:  31 January 2011

A. G. Evans ,
M. D. Drory  and
M. S. Hu
A. G. Evans
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
M. D. Drory
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
M. S. Hu
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
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Abstract

The cracking and decohesion of thin films can be characterized by critical values of a nondimensional parameter governed by the residual stress, the film thickness, and a fracture resistance. This article reviews the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness, and yield strength are described.

Type
Commentaries and Reviews
Information
Journal of Materials Research , Volume 3 , Issue 5 , October 1988 , pp. 1043 - 1049
Copyright
Copyright © Materials Research Society 1988

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References

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