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Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

Published online by Cambridge University Press:  23 January 2014

Wei-Hsun Chen*
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
Pylin Sarobol
Affiliation:
Coatings and Surface Engineering, Sandia National Laboratories, Albuquerque, New Mexico 87123
John R. Holaday
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
Carol A. Handwerker
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
John E. Blendell
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907
*
a)Address all correspondence to this author. e-mail: askachen@purdue.edu
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Abstract

A strategy for identifying the preferred sites and overall propensity of a Sn film to form whiskers has been developed based on film textures, local grain orientations, and elastic strain energy densities (ESEDs), with preferred sites predicted to be grains with local high ESEDs. Using β-Sn films with various textures, ESED distributions were simulated for elastic and thermoelastic stresses depending on isothermal aging or thermal cycling conditions. Local high ESEDs are preferentially induced in (110) or (100) oriented grains with c-axes nearly parallel to the film plane; films with overall low ESEDs have strong (100) textures for elastic stresses and strong (001) textures for thermoelastic stresses, suggesting low propensities to form whiskers. This work establishes a model for understanding the effect of the β-Sn anisotropy on whisker formation and provides guidelines for testing whether engineering specific film textures will reduce a film's propensity to form whiskers.

Type
Articles
Copyright
Copyright © Materials Research Society 2013 

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References

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