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Effect of substrate deformation on the microcantilever beam-bending test

Published online by Cambridge University Press:  31 January 2011

Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Peoples Republic of China
Ming-Hao Zhao
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Peoples Republic of China
Cai-Fu Qian
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, Peoples Republic of China
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Abstract

With regard to substrate deformation, this work analyzed the microcantilever beam-bending test and provided a closed formula of deflection versus load. The substrate deformation was formulated using two coupled springs; the spring compliances were related to the elastic compliances of the substrate, the support angle between the substrate and the microcantilever beam, and the beam thickness. Finite element analysis was conducted to calculate the spring compliances and verify the analytic formula. The results showed that the proportionality factor of the load to the deflection was a third-order polynomial of the length from the loading point to the fixed beam end. Examples are also given to indicate the relative error of Young's modulus when evaluated with the beam-bending theory without considering the substrate deformation.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1.Thin films-Stresses and Mechanical Properties I–VIII [Mater. Res. Soc. Symp. Proc. 130 (1988), 188 (1990), 239 (1991), 308 (1993), 356 (1994), 436 (1996), 505 (1997), 594 (1999), Pittsburgh, PA, and Warrendale, PA].Google Scholar
2.Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., J. Mater. Res. 3, 931 (1988).Google Scholar
3.Schweitz, J., MRS Bull. XVII(7), 34 (1992).CrossRefGoogle Scholar
4.Baker, S.P. and Nix, W.D., J. Mater. Res. 9, 3131 (1994).CrossRefGoogle Scholar
5.Timoshenko, S.P. and Gere, J.M., Mechanics of Materials (Van Nostrand, New York, 1972).Google Scholar
6.Mencik, J., Quandt, E., and Munz, D., Thin Solid Films 287, 208 (1996).Google Scholar
7.Zhang, T.Y., Su, Y.J., Qian, C.F., Zhao, M.H. and Chen, L.Q., Microbridge Testing of Thin Films Under Small Deformation, 1999 MRS Fall Meeting, Nov 30–Dec 4, 1999, Boston, MA (in press).Google Scholar
8.Zhang, T.Y., Su, Y.J., Qian, C.F., Zhao, M.H., and Chen, L.Q., Acta Mater. 48, 2843 (2000).Google Scholar
9.Hirth, J.P. and Lothe, J., Theory of Dislocations, 2nd ed. (John Wiley & Sons, New York, (1982).Google Scholar