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Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint

Published online by Cambridge University Press:  11 November 2014

Limin Ma ,
Yong Zuo Open the ORCID record for Yong Zuo [Opens in a new window] ,
Fu Guo  and
Yutian Shu
Limin Ma*
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Yong Zuo
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Fu Guo*
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Yutian Shu
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
*
a)Address all correspondence to this author. e-mail: guofu@bjut.edu.cn
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Abstract

Creep and electromigration (EM) have been two reliability concerns in microelectronic devices for a long time. The related failure mechanisms have been widely investigated and comprehended individually. However, there is a lack of attention with regard to the interaction(s) between current density and creep, the coupling effect of which is more analogous to the real service conditions of lead-free solder joint. In this study, a series of experiments were carried out on the simple shear lap joint to investigate the effects of current density magnitude on the creep behavior of solder joints. The results indicated that dislocation creep was the main failure mechanism for low current density sample. For high current density sample, the failure mechanism was mainly dominated by copper atom migrating process which led the joint experience a higher risk of brittle fracture failure.

Keywords

electromigrationmicrostructuremicroelectronics
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 22 , 28 November 2014 , pp. 2738 - 2747
Copyright
Copyright © Materials Research Society 2014 

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