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Fabrication and structural characterization of self-supporting electrolyte membranes for a micro solid-oxide fuel cell

Published online by Cambridge University Press:  03 March 2011

Chelsey D. Baertsch ,
Klavs F. Jensen ,
Joshua L. Hertz ,
Harry L. Tuller ,
Srikar T. Vengallatore ,
S. Mark Spearing  and
Martin A. Schmidt
Chelsey D. Baertsch
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Klavs F. Jensen*
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Joshua L. Hertz
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Harry L. Tuller
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Srikar T. Vengallatore
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
S. Mark Spearing
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Martin A. Schmidt
Affiliation:
Microsystems Technology Center, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
*
b)Address all correspondence to this author. e-mail: kfjensen@mit.edu
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Abstract

Micromachined fuel cells are among a class of microscale devices being explored for portable power generation. In this paper, we report processing and geometric design criteria for the fabrication of free-standing electrolyte membranes for microscale solid-oxide fuel cells. Submicron, dense, nanocrystalline yttria-stabilized zirconia (YSZ) and gadolinium-doped ceria (GDC) films were deposited onto silicon nitride membranes using electron-beam evaporation and sputter deposition. Selective silicon nitride removal leads to free-standing, square, electrolyte membranes with side dimensions as large as 1025 μm for YSZ and 525 μm for GDC, with high processing yields for YSZ. Residual stresses are tensile (+85 to +235 MPa) and compressive (–865 to -155 MPa) in as-deposited evaporated and sputtered films, respectively. Tensile evaporated films fail via brittle fracture during annealing at temperatures below 773 K; thermal limitations are dependent on the film thickness to membrane size aspect ratio. Sputtered films with compressive residual stresses show superior mechanical and thermal stability than evaporated films. Sputtered 1025-μm membranes survive annealing at 773 K, which leads to the generation of tensile stresses and brittle fracture at elevated temperatures (923 K).

Keywords

Thin filmPhysical vapor deposition (PVD)Microelectrical mechanical (MEMS)
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 9 , September 2004 , pp. 2604 - 2615
Copyright
Copyright © Materials Research Society 2004

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