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Finite element modeling of stress variation in multilayer thin-film specimens for in situ transmission electron microscopy experiments

Published online by Cambridge University Press:  31 January 2011

H. Mei ,
J.H. An ,
R. Huang  and
P.J. Ferreira
H. Mei
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, Texas 78712
J.H. An
Affiliation:
Materials Science and Engineering Program, University of Texas, Austin, Texas 78712
R. Huang
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, Texas 78712
P.J. Ferreira*
Affiliation:
Materials Science and Engineering Program, University of Texas, Austin, Texas 78712
*
a)Address all correspondence to this author. e-mail: reira@mail.utexas.edu
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Abstract

Multilayer thin-film materials with various thicknesses, compositions, and deposition methods for each layer typically exhibit residual stresses. In situ transmission electron microscopy (TEM) is a powerful technique that has been used to determine correlations between residual stresses and the microstructure. However, to produce electron transparent specimens for TEM, one or more layers of the film are sacrificed, thus altering the state of stresses. By conducting a stress analysis of multilayer thin-film TEM specimens, using a finite element method, we show that the film stresses can be considerably altered after TEM sample preparation. The stress state depends on the geometry and the interactions among multiple layers.

Keywords

Thin filmThermal stressesTransmission electron microscopy (TEM)
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2737 - 2741
Copyright
Copyright © Materials Research Society 2007

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References

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