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Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging

Published online by Cambridge University Press:  27 June 2011

Zhongbing Luo ,
Lai Wang ,
Qinqin Fu ,
Chongqian Cheng  and
Jie Zhao
Zhongbing Luo
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Lai Wang
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Qinqin Fu
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Chongqian Cheng
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
Jie Zhao*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
*
a)Address all correspondence to this author. e-mail: jiezhao@dlut.edu.cn
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Abstract

The formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing η-Cu6Sn5 and interfacial reaction at temperatures below 186 °C. A minimum formation time was observed in the temperature range of 135–150 °C.

Keywords

SolderingCompoundPhase transformation
Type
Materials Communications
Information
Journal of Materials Research , Volume 26 , Issue 12 , 28 June 2011 , pp. 1468 - 1471
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1.Laurila, T., Vuorinen, V., and Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005).CrossRefGoogle Scholar
2.Tarascon, J.M. and Armand, M.: Issues and challenges facing rechargeable lithium batteries. Nature 414, 359 (2001).CrossRefGoogle ScholarPubMed
3.Larsson, A.K., Stenberg, L., and Lidin, S.: The superstrusture of domain-twinned η′-Cu6Sn5. Acta Crystallogr. B 50, 636 (1994).CrossRefGoogle Scholar
4.Larsson, A.K., Stenberg, L., and Lidin, S.: Crystal structure modulations in η-Cu5Sn4. Z. Kristallogr. 210, 832 (1995).CrossRefGoogle Scholar
5.Lidin, S. and Larsson, A.K.: A survey of superstructures in intermetallic NiAs-Ni2In-type phases. J. Solid State Chem. 118, 313 (1995).CrossRefGoogle Scholar
6.Gangulee, A., Das, G.C., and Bever, M.B.: An x-ray diffraction and calorimetric investigation of the compound Cu6Sn5. Metall. Trans. 4, 2063 (1973).CrossRefGoogle Scholar
7.Ghosh, G. and Asta, M.: Phase stability, phase transformations, and elastic properties of Cu6Sn5: Ab initio calculations and experimental results. J. Mater. Res. 20, 3102 (2005).CrossRefGoogle Scholar
8.Nogita, K., Gourlay, C.M., and Nishimura, T.: Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. J. Miner. Met. Mater. Soc. 61, 45 (2009).CrossRefGoogle Scholar
9.Schwingenschlögl, U., Paola, C.D., Nogita, K., and Gourlay, C.M.: The influence of Ni additions on the relative stability of η and η′ Cu6Sn5. Appl. Phys. Lett. 96, 061908 (2010).CrossRefGoogle Scholar
10.Savitzky, A. and Golay, M.J.E.: Smoothing and differentiation of data by simplified least squares procedures. Anal. Chem. 36, 1627 (1964).CrossRefGoogle Scholar
11.Christian, J.W.: The Theory of Transformations in Metals and Alloys, 2nd ed. (Elsevier Science, Oxford, UK, 2002), pp. 11, 16, 532, 702–709.CrossRefGoogle Scholar