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Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

Published online by Cambridge University Press:  01 December 2004

Chia-Wei Huang  and
Kwang-Lung Lin
Chia-Wei Huang*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University,Tainan 701, Taiwan, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University,Tainan 701, Taiwan, Republic of China
*
a)Address all correspondence to this author.e-mail: matkllin@mail.ncku.edu.tw
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Abstract

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

Keywords

AgingIntermetallic alloysPackaging

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Type
Articles
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Journal of Materials Research , Volume 19 , Issue 12 , December 2004 , pp. 3560 - 3568
Copyright
Copyright © Materials Research Society 2004

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