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Microscale shear specimens for evaluating the shear deformation in single-crystal and nanocrystalline Cu and at Cu–Si interfaces

Published online by Cambridge University Press:  24 April 2019

Jonathan G. Gigax Open the ORCID record for Jonathan G. Gigax [Opens in a new window] ,
Jon K. Baldwin ,
Chris J. Sheehan ,
Stuart A. Maloy  and
Nan Li
Jonathan G. Gigax*
Affiliation:
Center for Integrated Technologies, MPA-CINT, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
Jon K. Baldwin
Affiliation:
Center for Integrated Technologies, MPA-CINT, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
Chris J. Sheehan
Affiliation:
Center for Integrated Technologies, MPA-CINT, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
Stuart A. Maloy
Affiliation:
MST-8, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
Nan Li
Affiliation:
Center for Integrated Technologies, MPA-CINT, Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA
*
a)Address all correspondence to this author. e-mail: jgigax@lanl.gov
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Abstract

Microscale testing has enjoyed significant developments, with the majority of testing focused on tensile/compression type tests and little focus on shear testing. With the recent advances in macroscale shear testing, we developed a novel shear structure for evaluating shear properties of bulk materials and films at the microscale. The shear response in single-crystal copper oriented along the [111] direction was found to have a yield strength of ∼180 MPa. Nanocrystalline copper specimens with different orientations showed sensitivity to the film texture with a shear yield strength nearly three times that of single-crystal copper. Shear specimens were fabricated with Cu film–Si substrate interface near the middle of the shear region and compressed to fracture. The shear response showed a mixed behavior of the stiff Si substrate and softer nanocrystalline film and failed in a brittle manner, indicating a response unique to the interface.

Keywords

Cumicrostructurestress–strain relationship

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