Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-28T00:19:26.688Z Has data issue: false hasContentIssue false
  • English
  • Français

Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

Published online by Cambridge University Press:  31 January 2011

C. Y. Liu  and
K. N. Tu
C. Y. Liu
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California 90095-1595
K. N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California 90095-1595
Get access

Extract

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 1 , January 1998 , pp. 37 - 44
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Wang, X. H. and Conrad, H., Scripta Metall. Mater. 31, 375 (1994).CrossRefGoogle Scholar
2.Chen, X., Sprecher, A. F., and Conrad, H., in Materials Development in Microelectronics Packaging: Performance and Reliability, edited by Singh, P. I. (ASM INTERNATIONAL, Materials Park, OH, 1991), p. 61.Google Scholar
3.Frear, D., Gravis, D., and Morris, J. W. Jr., J. Electron. Mater. 16, 181 (1987).CrossRefGoogle Scholar
4.Kim, H. K., Liou, H. K., and Tu, K. N., J. Mater. Res. 10, 497 (1995).Google Scholar
5.Bailey, G. L. J. and Watkins, H. C., J. Inst. Metals 80, 57 (1951–52).Google Scholar
6.McCormack, M. and Jin, S., J. Metals 45, 36 (1993).Google Scholar
7.Dunn, P. S., Marnis, T. F., Sherry, W. M., and Williams, C. J., in Electronic Packaging Materials Science, edited by Giess, E. A., Tu, K. N., and Uhlmann, D. R. (Mater. Res. Soc. Symp. Proc. 40, Pittsburgh, PA, 1985), p. 129.Google Scholar
8.Marotte, V. C. and Schroder, K., in Alloy Phase Diagrams, edited by Bennett, L. H., Massalski, T. B., and Giessen, B. C. (Mater. Res. Soc. Symp. Proc. 19, Pittsburgh, PA, 1983), p. 403.Google Scholar
9.Kawakatsu, I., Osawa, T., and Yamagnehi, H., Trans. JIM 13, 436 (1972).Google Scholar
10.Kay, P. J. and Makay, C. A., Trans. Inst. Metal Finishing 54, 68 (1976).Google Scholar
11.Grivas, D., Frear, D., Guan, L., and Morris, J. W. Jr., J. Electron. Mater. 15, 355 (1986).CrossRefGoogle Scholar
12.Young, T., Philos. Trans. R. Soc. London 95, 65 (1805).Google Scholar
13.Howie, F. H. and Hondros, E. D., J. Mater. Sci. 17, 1434 (1982).Google Scholar
14.Yost, F. G. and Romig, A. D. Jr., in Electronic Packaging Materials Science III, edited by Jaccodine, R., Jackson, K. A., and Sundahl, R. C. (Mater. Res. Soc. Symp. Proc. 108, Pittsburgh, PA, 1988).Google Scholar
15.Smith, G. C. and Lea, C., Surf. Interf. Anal. 9, 145 (1986).Google Scholar
16.Boettinger, W. J., Handwerker, C. A., and Smith, L. C., The Metal Science of Joining, edited by Cieslak, M. J., Perepezko, J. H., and Kang, S. (The Minerals, Metals and Materials Society, Warrendale, PA, 1992).Google Scholar
17.Romig, A., Chang, Y., Stephens, J., Frear, D., Marcotte, V., and Lea, C., in Solder Mechanics, edited by Frear, D., Jones, W., and Kinsman, K. (The Minerals, Metals and Materials Society, Warrendale, PA, 1991).Google Scholar