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Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn–Cu “bimetal ledge specimen”

Published online by Cambridge University Press:  31 January 2011

Lucine Reinbold ,
Nitin Jadhav ,
Eric Chason  and
K. Sharvan Kumar
Lucine Reinbold
Affiliation:
Division of Engineering, Brown University, Providence, Rhode Island 02912
K. Sharvan Kumar*
Affiliation:
Division of Engineering, Brown University, Providence, Rhode Island 02912
*
b) Address all correspondence to this author. e-mail: Sharvan_Kumar@brown.edu
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Abstract

Sn whisker formation was studied in a “bimetal ledge specimen” that consisted of a uniform layer of Sn that was covered by Cu on only half the sample. Whiskers are observed to grow in the Cu-free region of the sample, which is attributed to stress generated by the diffusion of Sn atoms along the network of columnar grain boundaries. The Sn diffusion is driven by the intermetallic growth, but the whisker density extends out much further than any measurable Cu concentration. Whiskers were also observed to grow in the Cu-coated region by punching through the overlayer, leaving a Cu-grain on the tip of the Sn whisker.

Keywords

CuSnThin film
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 12 , December 2009 , pp. 3583 - 3589
Copyright
Copyright © Materials Research Society 2009

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