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Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5

Published online by Cambridge University Press:  20 September 2011

Dekui Mu ,
Jonathan Read ,
Yafeng Yang  and
Kazuhiro Nogita
Dekui Mu*
Affiliation:
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
Jonathan Read
Affiliation:
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
Yafeng Yang
Affiliation:
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
Kazuhiro Nogita
Affiliation:
School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia
*
a)Address all correspondence to this author. e-mail: d.mu@uq.edu.au
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Abstract

Cu6Sn5 is a common intermetallic compound formed during electrical packaging. It has an allotropic transformation from the low-temperature monoclinic η’-Cu6Sn5 to high-temperature hexagonal η-Cu6Sn5 at equilibrium temperature 186 °C. In this research, the effects of this allotropic transformation and Ni addition on the thermal expansion of η’- and/or η-Cu6Sn5 were characterized using synchrotron x-ray diffraction and dilatometry. A volume expansion during the monoclinic to hexagonal transformation was found. The addition of Ni was found to decrease the undesirable thermal expansion by stabilizing the hexagonal Cu6Sn5 at temperatures below 186 °C and reducing the overall thermal expansion of Cu6Sn5.

Keywords

SolderingPhase transformationX-ray diffraction

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Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 20 , 28 October 2011 , pp. 2660 - 2664
Copyright
Copyright © Materials Research Society 2011

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References

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