Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-28T00:57:08.989Z Has data issue: false hasContentIssue false
  • English
  • Français

Young's modulus and tensile strength of CuNi(Mn) thin films on polyimide foils by tensile testing

Published online by Cambridge University Press:  31 January 2011

F. Macionczyk ,
W. Brückner ,
W. Pitschke  and
G. Reiss
F. Macionczyk
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
W. Pitschke
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
G. Reiss
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01171 Dresden, Germany
Get access

Abstract

Force-strain curves were measured for 1.0 μm and 1.5 μm thick Cu0.57Ni0.42Mn0.01 films on 8 μm thick polyimide foils by tensile testing. By separating the force working on the polyimide foil from that working on the metal-polyimide compound, stress-strain curves for the CuNi(Mn) films were obtained. Young's modulus and tensile strength were determined for as-deposited and annealed [350 °C, 1 h, N2/H2(5 vol%) atmosphere] films by this method. Crack propagation starts at the end of the elastic region at 0.2 to 0.7% strain, depending on the film thickness and the thermal treatment. The cracking behavior is described by a steady-state approximation.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 10 , October 1998 , pp. 2852 - 2858
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Nishino, I., Ichinose, Y., Sorimachi, Y., and Tsubata, I., Int. J. Hybrid Microelectron. 6, 18 (1985).Google Scholar
2.Brückner, W., St. Baunack, Elefant, D., and Reiss, G., J. Appl. Phys. 79 (11), 8516 (1996).CrossRefGoogle Scholar
3.Berlicki, T. H., Osadnik, S. J., and Prociow, E. L., Vide Sci. Tech. Appl. 279, 221 (1996).Google Scholar
4.Brückner, W., Edelmann, J., Vinzelberg, H., Reiss, G., and Knuth, Th., Thin Solid Films 280, 227 (1996).CrossRefGoogle Scholar
5.Rosenmayer, C. T., Brotzen, F. R., and Gale, R. J., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 77.Google Scholar
6.Ho, P. S. and Faupel, F., Appl. Phys. Lett. 53, 1602 (1988).CrossRefGoogle Scholar
7.Faupel, F., Yang, C. H., Chen, S. T., and Ho, P. S., J. Appl. Phys. 65 (5), 1917 (1989).CrossRefGoogle Scholar
8.Schröder, K., CRC Handbook of Electrical Resistivities of Binary Metallic Alloys (CRC, Boca Raton, FL, 1983), p. 224.Google Scholar
9.Svensson, B., Annalen der Physik 25, 263 (1936).CrossRefGoogle Scholar
10.Brückner, W., Schumann, J., Baunack, St., Pitschke, W., and Knuth, Th., Thin Solid Films 258, 236 (1995).CrossRefGoogle Scholar
11.Brückner, W., Pitschke, W., Baunack, St., Thomas, J., and Reiss, G., unpublished.Google Scholar
12.Klug, H. P. and Alexander, L. E., X-ray Diffraction Procedures for Polycrystalline and Amorphous Materials (John Wiley & Sons, New York, 1974).Google Scholar
13.Kohlrausch, F., Praktische Physik (Teubner, B. G., Stuttgart, Germany, 1996), Vol. 3, p. 300.Google Scholar
14.Iguchi, K. and Udagawa, E., J. Phys. F 5, 214 (1975).CrossRefGoogle Scholar
15.Haight, R., White, R. C., Silverman, B. D., and Ho, P. S., J. Vac. Sci. Technol. A6, 2188 (1988).CrossRefGoogle Scholar
16.Brückner, W., Phys. Status Solidi (a) 148, K89 (1995).CrossRefGoogle Scholar
17.Griffith, A. A., Philos. Trans. R. Soc. London A 221, 163 (1920).Google Scholar
18.Hu, M. S., Thouless, M. D., and Evans, A. G., Acta Metall. 36, 1301 (1988).CrossRefGoogle Scholar
19.Beuth, J. L., Int. J. Solids Structures 29 (13), 1657 (1992).CrossRefGoogle Scholar
20.Ye, T., Suo, Z., and Evans, A. G., Int. J. Solids Structures 29 (21), 2639 (1992).CrossRefGoogle Scholar
21.Hutchinson, J. W. and Suo, Z., Adv. Appl. Mech. 29, 63–191 (1992).CrossRefGoogle Scholar
22.Brückner, W., Macionczyk, F., and Reiss, G., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W. W., Gao, H., Sundgren, J-E., and Baker, S. P. (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1997), p. 47.Google Scholar