Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-28T16:24:20.974Z Has data issue: false hasContentIssue false
  • English
  • Français

Alternative technique for analyzing instrumented indentation data

Published online by Cambridge University Press:  31 January 2011

W. C. Oliver
W. C. Oliver
Affiliation:
Nano Instrument Innovation Center of MTS Systems Corporation, Oak Ridge, Tennessee 37830
Get access

Abstract

A new analysis technique for calculating the hardness, modulus, and contact area from indentation data obtained using pyramidal or conical indenters was formulated and compared with another commonly used technique. Experimental data using a Berkovich indenter to indent fused silica and tungsten were examined. In addition, finite element modeling results were used to examine the effectiveness of the analytical techniques when a wide range of materials properties was considered. The new technique relies on the slope of the loading curve rather than the indenter displacement as an input. It is shown that the new technique is far less affected by the deviation of the geometry of the indenter from its intended shape. This effect removes the necessity to have detailed descriptions of the precise tip geometry in some cases. The new technique does not reduce errors associated with pile up of material near the indenter.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 11 , November 2001 , pp. 3202 - 3206
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).Google Scholar
2.Yoffee, E.H., Philos. Mag. A 50, 813 (1984).Google Scholar
3.Hay, J.C., Bolshakov, A., and Pharr, G.M., J. Mater. Res. 14, 2296 (1999).Google Scholar
4.Hay, J.L. and Wolff, P.J., J. Mater. Res. (2000, in press).Google Scholar
5.Bolshakov, A. and Pharr, G.M., J. Mater. Res. 13, 1049 (1998).CrossRefGoogle Scholar
6.Tsui, T.Y. and Pharr, G.M., J. Mater. Res. 14, 292 (1999).Google Scholar
7.Wolff, P.J., Lucas, B.N., and Herbert, E.G., in Thin Films—Stresses and Mechanical Properties, VIII, edited by Vinci, R., Kraft, O., Moody, N., Besser, P., and Shaffer, E., II (Mater. Res. Soc. Symp. Proc. 594, Warrendale, PA, 2000), pp. 301–306.Google Scholar
8.Malzbender, J., de With, G., and den Toonder, J., J. Mater. Res. 15, 1209 (2000).CrossRefGoogle Scholar
9.Joslin, D.L. and Oliver, W.C., J. Mater. Res. 5, 123 (1990).Google Scholar