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Atomic force microscopy study of the role of molecular weight of poly(acrylic acid) in chemical mechanical planarization for shallow trench isolation

Published online by Cambridge University Press:  01 February 2006

Chae-Woong Cho
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Sang-Kyun Kim
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Ungyu Paik*
Affiliation:
Department of Ceramic Engineering, Hanyang University, Seoul 133-791, Korea
Jea-Gun Park
Affiliation:
Nano-SOI Process Laboratory, Hanyang University, Seoul 133-791, Korea
Wolfgang M. Sigmund
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, Florida, 32611-6400
*
a)Address all correspondence to this author. e-mail: upaik@hanyang.ac.kr
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Abstract

The influence of the molecular weight of poly(acrylic acid) (PAA) on chemical mechanical planarization (CMP) for shallow trench isolation (STI) was investigated. The adsorption behaviors of PAA as a function of molecular weight on deposited plasma-enhanced tetraethylorthosilicate and chemical vapor deposition Si3N4 films were analyzed by the force measurement using atomic force microscopy (AFM). The AFM results revealed that the affinity of PAA with the nitride film is higher than the affinity with the oxide film, and thus a denser adsorption layer on the nitride film is formed with higher molecular weight of PAA, which leads to higher selectivity in STI CMP. Additionally, to determine the correlation between the dispersion stability of the CeO2 resulting from the presence of PAA with different molecular weight and CMP performance, the colloidal properties of the slurry as a function of the molecular weight of PAA were examined.

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Articles
Copyright
Copyright © Materials Research Society 2006

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