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Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys

Published online by Cambridge University Press:  31 January 2011

Jenn Ming Song  and
Kwang Lung Lin
Jenn Ming Song
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Kwang Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Abstract

This study investigated the characteristics of the intermetallics that appear in Sn–Zn–Ag solder alloys, particularly their behavior in molten solder during cooling and remelting. The results indicated that the intermetallics, which deplete the Zn-rich phase, were present in the form of inhomogeneous dendrites and consisted of two intermetallic phases, ε–AgZn3 and γ–Ag5Zn8. These Ag–Zn intermetallics formed as the primary dendrites upon cooling from temperatures slightly below 300 °C. These intermetallics transformed into coarse nodules with a stable, high Ag-content phase when isothermally heated at 250 °C. These massive intermetallic particles tended to settle at the bottom of the melt due to low buoyancy. Isothermal heating at slightly above 300 °C resulted in the rapid melting of these intermetallics. Subsequent quenching caused numerous fine dendritic intermetallics to form throughout the solder.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 9 , September 2003 , pp. 2060 - 2067
Copyright
Copyright © Materials Research Society 2003

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