Hostname: page-component-78c5997874-xbtfd Total loading time: 0 Render date: 2024-11-11T05:49:33.385Z Has data issue: false hasContentIssue false
  • English
  • Français

Bonding strength of a carbon nanofiber array to its substrate

Published online by Cambridge University Press:  03 March 2011

Yi Zhang ,
Ephraim Suhir ,
Yuan Xu  and
Claire Gu
Yi Zhang
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Ephraim Suhir*
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Yuan Xu
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
Claire Gu
Affiliation:
Nanoconduction, Inc., Sunnyvale, California 94085; and University of California, Santa Cruz, California 95064
*
a) Address all correspondence to this author. e-mail: suhire@aol.com
Get access

Abstract

The bonding strength of a carbon nanofiber array (CNFA) grown on a copper substrate is evaluated based on the measured shearing force-at-failure and the developed analytical stress model that enables one to determine the magnitude and the distribution of the interfacial shearing stress causing the measured (given) shearing force. The experiment is conducted using specially designed test specimens. A table version of the Instron tester is used to measure the applied force and the corresponding displacement in shear. The maximum predicted shear-off stress is about 300 psi (0.211 kgf/m2), and was determined, based on the developed stress model, as a product of the measured 5 kgf/m force at the interface failure and the computed parameter k = 0.0422 m–1 of the interfacial shearing stress.

Keywords

BondingNanostructureStrength
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 11 , November 2006 , pp. 2922 - 2926
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Iijima, S.: Helical microtubules of graphitic carbon. Nature 354, 56 (1991).CrossRefGoogle Scholar
2.Ngo, Q., Cruden, B.A., Cassell, A.M., Sims, G., Meyyappan, M., Li, J., Yang, C.Y.: Thermal interface properties of Cu-filled vertical aligned carbon nanofiber arrays. Nano Lett. 4, 2403 (2004).Google Scholar
3.Xu, J., Fisher, T.S.: Enhancement of thermal interface materials with carbon nanotube arrays. Int. J. Heat Mass Transfer 49, 1658 (2006).Google Scholar
4.Wang, X.W., Zhong, Z., Xu, J.: Noncontact thermal characterization of multiwall carbon nanotubes. J. Appl. Phys. 97, 064302 (2005).Google Scholar
5.Xu, Y., Zhang, Y., Wang, X.W.: Thermal properties characterization of vertically aligned carbon nanotubes array used for IC cooling. J. Appl. Phys. (2006).Google Scholar
6.Cui, H., Kalinin, S.V., Yang, X., Lowndes, D.H.: Nano Lett. 4, 2157 (2004).CrossRefGoogle Scholar
7.Chen, I.C., Chen, L.H., Ye, X.R., Daraio, C., Jin, S., Orme, C.A., Quist, A., Lal, R.: Appl. Phys. Lett. 88, 153102 (2006).Google Scholar
8.Suhir, E.: Interfacial stresses in bi-metal thermostats. ASME J. Appl. Mechan. 56, 595 (1989).Google Scholar
9.Suhir, E.: Thermomechanical stress modeling in microelectronics and photonics. Electronic Cooling 7, 4 (2001).Google Scholar
10.Suhir, E.: Thermal stress in an adhesively bonded joint with a low modulus adhesive layer at the ends. J. Appl. Phys. 93, 3657 (2003).Google Scholar
11.Suhir, E.: Analysis of interfacial thermal stresses in a tri-material assembly. J. Appl. Phys. 89, 3685 (2001).Google Scholar
12.Cruden, B.A., Cassell, A.M., Ye, Q., Meyyappan, M.: Reactor design considerations in the hot filament/direct current plasma synthesis of carbon nanofibers. J. Appl. Phys. 94, 4070 (2003).Google Scholar
13.Li, J., Steven, R., Delzeit, L., Ng, H.T., Cassell, A., Han, J., Meyyappan, M.: Electronic properties of multiwalled carbon nanotubes in an embedded vertical array. Appl. Phys. Lett. 81, 910 (2002).Google Scholar