Hostname: page-component-cd9895bd7-p9bg8 Total loading time: 0 Render date: 2024-12-30T23:36:27.194Z Has data issue: false hasContentIssue false

Comparison of hydrophilic properties of amorphous TiOx films obtained by radio frequency sputtering and plasma-enhanced chemical vapor deposition

Published online by Cambridge University Press:  31 January 2011

Masatoshi Nakamura*
Affiliation:
Graduate School of Electronic Science and Technology, Shizuoka University, 3-5-1 Johoku, Hamamatsu, 432-8011, Japan
Toru Aoki
Affiliation:
Graduate School of Electronic Science and Technology, Shizuoka University, 3-5-1 Johoku, Hamamatsu, 432-8011, Japan
Yoshinori Hatanaka
Affiliation:
Graduate School of Electronic Science and Technology, Shizuoka University, 3-5-1 Johoku, Hamamatsu, 432-8011, Japan
Dariusz Korzec
Affiliation:
Microstructure Center, University of Wuppertal, Obere Lichtenplatzer Strasse 336
Jurgen Engemann
Affiliation:
Microstructure Center, University of Wuppertal, Obere Lichtenplatzer Strasse 336
*
a)Address all correspondence to this author. e-mail: nakamura@vc.gsest.shizuoka.ac.jp
Get access

Abstract

The hydrophilic properties of amorphous TiOx films prepared by different methods, e.g., radio frequency (rf) sputtering and plasma-enhanced chemical vapor deposition (PECVD), were studied. It was found that the hydrophilicity strongly depends on the film structure. The best hydrophilicity was realized with the PECVD amorphous film having distorted Ti–O bonds due to a large amount of OH groups. These characteristics of the PECVD amorphous film suggest that such a low-density film including distorted Ti–O bonds could increase the photoenhancement efficiency by ultraviolet radiation. This reason is also supported from the results that a low-density rf sputtered film presented a higher hydrophilicity compared to a high-density radio frequency sputtered film. Furthermore, both electrical and chemical effects of OH groups will also contribute to the good hydrophilicity of the PECVD film.

Type
Articles
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Negishi, N., Iyoda, T., Hashimoto, K., and Fujishima, A., Chem. Lett. 841 (1995).Google Scholar
2.Ohko, Y. and Fujishima, A., J. Phys. Chem. B 102, 1724 (1998).CrossRefGoogle Scholar
3.Ohko, Y., Tryk, D.A., Hashimoto, K., and Fujishima, A., J. Phys. Chem. B 102, 2699 (1998).Google Scholar
4.Anderson, C. and Bard, A.J., J. Phys. Chem. B 101, 2611 (1997).Google Scholar
5.Sakai, N., Wang, R., Fujishima, A., Watanabe, T., and Hashimoto, K., Langmuir 14, 5918 (1998).CrossRefGoogle Scholar
6.Wang, R., Hashimoto, K., Fujishima, A., Chikuni, M., Kojima, E., Kitamura, A., Shimohigoshi, M., and Watanabe, T., Nature 388, 431 (1997).Google Scholar
7.Hashimoto, K. and Watanabe, T., J. Surf. Sci. Soc. Jpn. 20, 85 (1999).Google Scholar
8.Nakamura, M., Aoki, T., and Hatanaka, Y., Vacuum 59, 506 (2000).Google Scholar
9.Mildner, M., Korzec, D., and Engemann, J., Surf. Coat. Technol. 112, 366 (1999).CrossRefGoogle Scholar
10.Swanpole, R., J. Phys. E: Sci. Instrum 16, 1214, (1983).Google Scholar
11.Zahng, F. and Liu, X., Thin Solid Films 326, 171 (1998).Google Scholar
12.Musić, S., Gotić, M., Ivanda, M., Popović, S., Turković, A., Trojko, R., Sekulić, A., and Furić, K., Mater. Sci. Eng. B 47, 33 (1997).Google Scholar
13.Izutsu, H., Mater. Res. Bull. 32, 1303 (1997).Google Scholar
14.Zeitler, V.A. and Brown, C.A., J. Phys. Chem. 61, 1174 (1957).CrossRefGoogle Scholar
15.Anpo, M., Yamashita, H., Ichihashi, Y., Fujii, Y., and Honda, M., J. Phys. Chem. B 101, 2632 (1997).Google Scholar
16.Anpo, M., Catal. Surv. Jpn. 1, 169 (1997).Google Scholar
17.Paul, W., Lewis, A.J., Connell, G.A.N., and Moustakas, T.D., Solid State Commun. 20, 969 (1976).Google Scholar
18.Watanabe, T., Nakajima, A., Wang, R., Minabe, M., Koizumi, S., Fujishima, A., and Hashimoto, K., Thin Solid Films 351, 260 (1999).Google Scholar