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Control of nanosilver sintering attained through organic binder burnout

Published online by Cambridge University Press:  31 January 2011

John G. Bai ,
Thomas G. Lei ,
Jesus N. Calata  and
Guo-Quan Lu
John G. Bai*
Affiliation:
Center for Power Electronics Systems and Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Thomas G. Lei
Affiliation:
Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Jesus N. Calata
Affiliation:
Center for Power Electronics Systems and Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
Guo-Quan Lu
Affiliation:
Center for Power Electronics Systems, Department of Materials Science and Engineering, and Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061
*
a)Address all correspondence to this author. e-mail: gbai@vt.edu
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Abstract

Control of the low-temperature sintering of nanosilver particles was attained by dispersing and stabilizing nanosilver particles into a paste form using the selected organic binder systems. As demonstrated by scanning electron microscopy (SEM) and thermogravimetric analysis (TGA), with the existing binder systems, undesirable premature coalescence of nanosilver particles was prevented and the metastable structure was retained until the binder burned out at relatively higher temperatures. Enhanced densification was achieved upon the binder burnout because at the relatively higher temperatures the densification mechanisms, e.g., grain-boundary or lattice diffusion, become more dominant. We propose that the onset of sintering, extent of densification, and final grain size can be controlled by either the size of the initial nanosilver particles or the binder systems with different burnout characteristics.

Keywords

SinteringPasteThermogravimetric analysis (TGA)
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 12 , December 2007 , pp. 3494 - 3500
Copyright
Copyright © Materials Research Society 2007

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References

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