Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Paik, K.W.
and
Mogro-Campero, A.
1994.
Studies on the high-temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B,
Vol. 17,
Issue. 3,
p.
435.
Paik, K.W.
and
Mogro-Campero, A.
1994.
Studies on the high temperature superconductor (HTS)/metal/polymer dielectric interconnect structure for packaging applications.
p.
362.
Mogro-Campero, A.
Paik, K. W.
and
Turner, L. G.
1995.
Degradation of thin films of YBa2Cu3O7 by annealing in air and in vacuum.
Journal of Superconductivity,
Vol. 8,
Issue. 1,
p.
95.
Vutova, K.
Mladenov, G.
Raptis, I.
and
Olziersky, A.
2007.
Process simulation at electron beam lithography on different substrates.
Journal of Materials Processing Technology,
Vol. 184,
Issue. 1-3,
p.
305.
Bonura, Marco
Cayado, Pablo
Konstantopoulou, Konstantina
Alessandrini, Matteo
and
Senatore, Carmine
2022.
Heating-Induced Performance Degradation of REBa2Cu3O7–x Coated Conductors: An Oxygen Out-Diffusion Scenario with Two Activation Energies.
ACS Applied Electronic Materials,
Vol. 4,
Issue. 3,
p.
1318.
Yang, Shige
Tang, Bohan
Yue, Zhilai
Yu, Hui
Xie, Bowen
Li, Sicheng
Chen, Yanquan
Niu, Rui
Zhao, Jun
Zhou, Peng
Chen, Wenge
Jiang, Shili
Jiang, Donghui
and
Kuang, Guangli
2024.
Thermal degradation analysis and optimization of controlled heat treatment for stacked high temperature superconducting tapes.
Superconductor Science and Technology,
Vol. 37,
Issue. 9,
p.
095023.