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Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints

Published online by Cambridge University Press:  31 January 2011

H.F. Zou  and
Z.F. Zhang
H.F. Zou
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, People’s Republic of China
Z.F. Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: zhfzhang@imr.ac.cn
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Abstract

The current study revealed the effects of strain rate on tensile strength and ductile-to-brittle transition of Sn–3Cu/Cu joints in the strain rate range of 4.2 × 10−5 to 2.4 × 10−1 s−1. Experimental results indicate that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength but displayed a brittle manner at higher strain rates with a slow increase in the tensile strength, indicating a typical ductile-to-brittle transition feature. A method was proposed to estimate the interfacial strength between the solder and the intermetallic compounds.

Keywords

AdhesionFractureSoldering
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 6 , June 2008 , pp. 1614 - 1617
Copyright
Copyright © Materials Research Society 2008

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