Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-10T10:13:26.206Z Has data issue: false hasContentIssue false
  • English
  • Français

Early dissolution behavior of copper in a molten Sn–Zn–Ag solder

Published online by Cambridge University Press:  01 March 2005

Chang-Ho Yu  and
Kwang-Lung Lin
Chang-Ho Yu
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
*
a)Address all correspondence to this author. e-mail: matkllin@mail.ncku.edu.tw
Get access

Abstract

The early dissolution behavior of Cu in a molten Sn–Zn–Ag solder was studied at 250 °C by fast quenching the dissolving specimen in liquid nitrogen. The atomic level dissolution behavior of Cu in the molten solder was revealed by high-resolution transmission electron microscopy. The dissolution of Cu occurs through channel dissolution and thermal vibrational dissolution. The dissolution channel has a dimension of less than 0.5 nm. The formation of channels, and thus the channel zone, is initiated by preferential removal of Cu atoms from the surface vacant site of Cu lattice. Relict strips of lattice between channels subsequently dissolve into the molten solder with the aid of thermal vibration and the interaction with liquid Zn atoms. The dissolved atoms form an atomic cluster zone. These clusters are the intermediate state of the dissolution of Cu from the channel zone into the molten Sn–Zn–Ag solder. The clusters convert into an amorphous structure prior to further formation of compound.

Keywords

MicrostructurePackagingRapid solidification
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 3 , March 2005 , pp. 666 - 671
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. 27, 95 (2000).CrossRefGoogle Scholar
2.Tu, K.N. and Zeng, K.: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).CrossRefGoogle Scholar
3.Chen, S.W. and Yen, Y.W.: Interfacial reactions in Ag-Sn/Cu couples. J. Electron. Mater. 28, 1203 (1999).CrossRefGoogle Scholar
4.Yoon, S.W., Soh, J.R., Lee, H.M. and Lee, B-J.: Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn–Bi–In–Zn system. Acta Mater. 45, 951 (1997).CrossRefGoogle Scholar
5.Lee, B-J., Hwang, N.M. and Lee, H.M.: Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 (1997).CrossRefGoogle Scholar
6.Suganuma, K., Niihara, K., Shoutoku, T. and Nakamura, Y.: Wetting and interface microstructure between Sn–Zn binary alloys and Cu. J. Mater. Res. 13, 2859 (1998).CrossRefGoogle Scholar
7.Liu, C.Y. and Tu, K.N.: Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film. Phys. Rev. E 58, 6308 (1998).CrossRefGoogle Scholar
8.Lin, K.L. and Shin, C.L.: Wetting interaction between Sn–Zn–Ag solders and Cu. J. Electron. Mater. 32, 95 (2003).CrossRefGoogle Scholar
9.Crommie, M.F., Lutz, C.P. and Eigler, D.M.: Imaging standing waves in a two-dimensional electron gas. Nature 363, 524 (1993).CrossRefGoogle Scholar
10.Crommie, M.F., Lutz, C.P. and Eigler, D.M.: Confinement of electrons to quantum corrals on a metal surface. Science 262, 218 (1993).CrossRefGoogle ScholarPubMed
11.Hasegawa, Y. and Avouris, Ph.: Direct observation of standing wave formation at surface steps using scanning tunneling spectroscopy. Phys. Rev. Lett. 71, 1071 (1993).CrossRefGoogle ScholarPubMed
12.Huang, F.H. and Huntington, H.B.: Diffusion of Sb124, Cd109, Sn113, and Zn65 in tin. Phys. Rev. B 9, 1479 (1974).CrossRefGoogle Scholar
13.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M. and Kelley, K.K.: Copper-zinc, in Selected Values of the Thermodynamic Properties of Binary Alloys (ASM, Metals Park, OH, 1973), pp. 810–822.Google Scholar
14.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M. and Kelley, K.K.: Copper-tin, in Selected Values of the Thermodynamic Properties of Binary Alloys (ASM International, Metals Park, OH, 1973), pp. 795–800.Google Scholar
15.Hultgren, R., Desai, P.D., Hawkins, D.T., Gleiser, M. and Kelley, K.K.: Silver-copper, in Selected Values of the Thermodynamic Properties of Binary Alloys (ASM, Metals Park, OH, 1973), pp. 44–49.Google Scholar
16.Hyldgaard, P. and Persson, M.: Substrate mediated long-range oscillatory interaction between adatoms: Cu/Cu (111). Phys. Rev. Lett. 85, 2981 (2000).Google Scholar
17.Peng, M. and Mikula, A.: Thermodynamic properties of liquid Cu–Sn–Zn alloys. J. Alloys Compd. 247, 185 (1997).CrossRefGoogle Scholar
18.Ma, D., Wang, W.D. and Lahiri, S.K.: Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow. J. Appl. Phys. 91, 3312 (2002).CrossRefGoogle Scholar
19.Ghosh, G.: Coarsening kinetics of Ni3Sn4 sacllops during interfacial reaction between liquid eutectic solders and Cu/Ni/Pd metallization. J. Appl. Phys. 88, 6887 (2000).CrossRefGoogle Scholar
20.Hu, C.K. and Huntington, H.B.: Atom motions of copper dissolved in lead-tin alloys. Phys. Rev. B 28, 579 (1983).CrossRefGoogle Scholar