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Effect of dose stoichiometry on the structure of vapor-deposited polyimide thin films

Published online by Cambridge University Press:  03 March 2011

R.G. Pethe ,
C.M. Carlin ,
H.H. Patterson  and
W.N. Unertl
R.G. Pethe
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
C.M. Carlin
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
H.H. Patterson
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
W.N. Unertl*
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
*
d)Author to whom correspondence should be addressed.
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Abstract

PMDA-ODA polyimide thin films can be formed by vapor co-deposition of the precursor molecules PMDA (pyromellitic dianhydride) and ODA (4, 4′-oxydianiline) if the resulting polyamic acid film is heated to a 473 to 573 K cure step. We have used laser Raman spectroscopy to study how dose composition, dose rate, and substrate temperature influence the properties of the resulting polyimide films. We find that only doses with excess PMDA produce high quality films. Doses with 1 : 1 stoichiometry or excess ODA produce thermally unstable films that contain imine bonds; these films decompose below 575 K. Dosing onto substrates below 315 K produces the polyamic acid precursor of polyimide. At higher substrate temperatures, films with high defect densities or decomposed films are produced. The equilibrium vapor pressures of ODA and PMDA are reported.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 12 , December 1993 , pp. 3218 - 3228
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1Satou, H., Suzuki, H., and Makino, D., in Polyimides, edited by Wilson, D., Stenzenberger, H. D., and Hergenrother, P. M. (Chapman and Hall, New York, 1990), p. 227.CrossRefGoogle Scholar
2Polyimides and Other High-Temperature Polymers, edited by Abadie, M. J. M. and Sillion, B. (Elsevier, Amsterdam, 1991).Google Scholar
3Soane, D. S. and Martynenko, Z., Polymers in Microelectronics (Elsevier, Amsterdam, 1989).Google Scholar
4Salem, J. R., Sequeda, F. O., Duran, J., Lee, W. Y., and Yang, R. M., J. Vac. Sci. Technol. A 4, 369 (1986).CrossRefGoogle Scholar
5Iijima, M., Takahashi, Y., Inagawa, K., and Itoh, A., J. Vac. Soc. Jpn. 28, 437 (1985).CrossRefGoogle Scholar
6Kowalczyk, S. P., Kim, Y. H., Walker, G. F., and Kim, J., Appl. Phys. Lett. 52, 375 (1988).CrossRefGoogle Scholar
7Harris, F. W., in Polyimides, edited by Wilson, D., Stenzenberger, H. D., and Hergenrother, P. M. (Chapman and Hall, New York, 1990), p. 1.Google Scholar
8Tsapovetsky, M. I. and Laius, L. A., in Polyimides: Materials, Chemistry, and Characterization, edited by Feger, C., Khojasteh, M. M., and McGrath, J. E. (Elsevier Scientific Publishing Co., New York, 1989), p. 379.Google Scholar
9Hay, J. N., Boyle, J. D., James, P. G., Walton, J. R., and Wilson, D., in Polyimides: Materials, Chemistry, and Characterization, edited by Feger, C., Khojasteh, M. M., and McGrath, J. E. (Elsevier Scientific Publishing Co., New York, 1989), p. 305.Google Scholar
10Saini, A. K., Carlin, C. M., and Patterson, H. H., J. Polym. Sci., Polym. Chem. Ed. 30, 419 (1992).CrossRefGoogle Scholar
11Zurakovska-Orszagh, J., Eur. Polym. J. 15, 409 (1979).CrossRefGoogle Scholar
12Lamb, R. N., Baxter, J., Gmnze, M., Kong, C. W., and Unertl, W. N., Langmuir 4, 249 (1988).CrossRefGoogle Scholar
13Mack, R. G., Patterson, H. H., Cook, M. R., and Carlin, C. M., J. Polym. Sci., Polym. Lett. Ed. 27, 25 (1989).CrossRefGoogle Scholar
14Kowalczyk, S. P., Dimitrakopoulos, C. D., and Molis, S. E., in Materials Science of High Polymers for Microelectronics, edited by Grubb, D. T., Mita, I., and Yoon, D. Y. (Mater. Res. Soc. Symp. Proc. 227, Pittsburgh, PA, 1991), p. 55.Google Scholar
15Saini, A. K., Ph. D. Thesis, University of Maine (1991).Google Scholar
16Strunskus, T., Grunze, M., and Gnanarajan, S., in Metallization of Polymers, edited by Sacher, E., Pireaux, J. J., and Kowalczyk, S. P. (American Chemical Society, Washington, DC, 1990), p. 353.CrossRefGoogle Scholar
17Pethe, R. G., Ph. D. Thesis, University of Maine (1991).Google Scholar
18Purchased from Aldrich Chemical Co., Milwaukee, WI.Google Scholar
19Grunze, M., Unertl, W. N., Gnanarajan, S., and French, J., in Electronic Packaging Materials Science III, edited by Jaccodine, R., Jackson, K. A., and Sundahl, R. C (Mater. Res. Soc. Symp. Proc. 108, Pittsburgh, PA, 1988), p. 189.Google Scholar
20Grunze, M. and Lamb, R. N., Chem. Phys. Lett. 133, 283 (1987).CrossRefGoogle Scholar
21Ashton, M. R., Jones, T. S., Richardson, N. V., Mack, R. G., and Unertl, W. N., J. Electron. Spectrosc. 54/55, 1133 (1990).CrossRefGoogle Scholar
22Deakin, R. and Butry, D. A., Anal. Chem. 61, 1147A (1989).CrossRefGoogle Scholar
23Boeyens, J. C. A. and Herbstein, F. H., J. Phys. Chem. 69, 2160 (1965).CrossRefGoogle Scholar
24We used the database in the software package CHEM 3D PLUS, Cambridge Scientific Computing, Inc. Cambridge, MA.Google Scholar
25Elshazly, O., Ph. D. Thesis, University of Maine (1987, unpublished).Google Scholar
26Salem, J. R., IBM, private communication.Google Scholar
27Hahn, C., University of Maine, private communication.Google Scholar
28Purchased from Alpha Products, Danvers, MA.Google Scholar
29Lamb, R. N., Grunze, M., Baxter, J., Kong, C. W., and Unertl, W. N. in Adhesion and Friction, edited by Grunze, M. and Kreuze, H. J. (Springer-Verlag, Heidelberg, 1989), p. 36.CrossRefGoogle Scholar
30Perry, S. S. and Campion, A., Surf. Sci. 259, 207 (1991); Surf. Sci. Lett. 234, L275 (1990); J. Electron. Spectrosc. 54/55, 933 (1990).CrossRefGoogle Scholar
31Ishida, H., Wellinghoff, S. T., Baer, E., and Koenig, J. L., Macromol. 13, 826 (1980).CrossRefGoogle Scholar
32Hase, Y., Kawai, K., and Sala, O., J. Mol. Structure 26, 297 (1975).CrossRefGoogle Scholar
33Hase, Y., Spectrosc. Lett. 12, 75 (1979).CrossRefGoogle Scholar
34Wellinghoff, S. T., Ishida, H., Koenig, J. L., and Baer, E., Macromol. 13, 834 (1970).CrossRefGoogle Scholar
35Bigotto, A., Galasso, V., and Hase, Y., Spectrochim. Acta 17A, 829 (1981).CrossRefGoogle Scholar
36Kelly, K., Ishino, Y., and Ishida, H., Thin Solid Films 154, 271 (1987).CrossRefGoogle Scholar
37The Aldrich Library of FT-IR Spectra, edited by Pouchert, C. T. (Aldrich Chemical Co., Milwaukee, WI, 1985).Google Scholar