Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2025-01-02T19:09:52.955Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of internal stress on elemental diffusion and crystallization of electroless Ni–Cu–P deposit on Al

Published online by Cambridge University Press:  31 January 2011

Jen-Che Hsu  and
Kwang-Lung Lin
Jen-Che Hsu
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
Get access

Abstract

The type and magnitude of stress in electroless Ni–Cu–P deposits on Al were manipulated by controlling the concentration of saccharin in the plating solution. Tensile, zero, and compressive stress of the electroless Ni–Cu–P deposits was obtained with 0, 8, and 10 g/l saccharin for studying the effect of stress on the diffusion and crystallization behavior of the deposit. The effect of stress on the diffusion behavior of Cu, Ni, and Al elements during annealing was investigated. Interdiffusion between Al and Ni in an amorphous Ni–Cu–P/crystal Al diffusion couple is abated by the effects of amorphous structure, atomic affinity, and backstress. Therefore, the effect of stress on diffusion is manifested by Cu elemental diffusion. The tensile stress promotes the formation of Ni3P and the diffusion of Cu into the substrate.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 9 , September 2003 , pp. 2221 - 2227
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Mallory, G.O. and Hajdu, J.B., Electroless Plating: Fundamentals and Applications (American Electroplaters and Surface Finishers Society, Orlando, FL, 1990), pp. 229, 260.Google Scholar
2.Takano, O. and Aoki, K., J. Met. Finish. Soc. Jpn. 34, 316 (1983).CrossRefGoogle Scholar
3.Hur, K.H., Jeong, J.H., and Lee, D.N., J. Mater. Sci. 26, 2037 (1991).CrossRefGoogle Scholar
4.Krasteva, N., Fotty, V., and Armyanov, S., J. Electrochem. Soc. 141, 2864 (1994).CrossRefGoogle Scholar
5.Wang, Y.W., Xiao, C.G., and Deng, Z.G., Plat. Surf. Finish. 79, 57 (1992).Google Scholar
6.Lee, C.Y. and Lin, K.L., Jpn. J. Appl. Phys. 33, 4708 (1994).Google Scholar
7.Mallory, G.O. and Hajdu, J.B., Electroless Plating: Fundamentals and Applications (American Electroplaters and Surface Finishers Society, Orlando, FL, 1990), pp. 111, 138.Google Scholar
8.Chen, C.J. and Lin, K.L., Thin Solid Films 370, 106 (2000).CrossRefGoogle Scholar
9.Dini, J.W., Electrodeposition (Noyes Publications, Park Ridge, NJ, 1993), pp. 279, 303.Google Scholar
10.Dennis, J.K. and Such, T.E., Nickel and Chromium Plating, Third ed. (American Society for Metals, Materials Park, OH, 1993), pp. 96, 131.CrossRefGoogle Scholar
11.Reed-Hill, R.E. and Abbaschian, R., Physical Metallurgy Principles, 3rd ed. (Wadsworth, Belmont, CA, 1992), pp. 836, 899.Google Scholar
12.Brenner, A. and Senderoff, S., J. Res. NBS 42, 105 (1949).Google Scholar
13.Weil, R., Plating 57, 1231 (1970).Google Scholar
14.Ross, R.B., Metallic Materials Specification Handbook, Third ed. (E. & F.N.Spon, London, 1980), p. 1.Google Scholar
15.Barrett, C.R., Nix, W.D., and Tetelman, A.S., The Principles of Engineering Materials (Prentice Hall, Englewood Cliffs, NJ, 1973), p. 134.Google Scholar
16.Parker, K. and Shah, H., Plating 58, 230 (1971).Google Scholar
17.Mehrer, H., Defect Diffusion Forum 129–130, 57 (1996).CrossRefGoogle Scholar
18.Philibert, J., Defect Diffusion Forum 129–130, 3 (1996).CrossRefGoogle Scholar
19. F.A Lewis, Kandasamy, K., and Tong, X.Q., Int. J. Hydrogen Energy 27, 687 (2002).Google Scholar
20.Cottrell, A.H., Intermetallics 4, 1 (1996).CrossRefGoogle Scholar
21.Shankar, S. and Seigle, L.L., Metall. Mater. Trans. A 9, 1467 (1978).CrossRefGoogle Scholar