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The effect of molding pressure on the structural and electrical properties of Y1Ba2Cu3O7−δ superconductors

Published online by Cambridge University Press:  31 January 2011

C. O. Kim
Affiliation:
Department of Physics, Hanyang University, Seoul 133-791, Korea
J. S. Park
Affiliation:
Department of Physics, Hanyang University, Seoul 133-791, Korea
T. W. Kim
Affiliation:
Department of Physics, Kwangwoon University, 447-1 Wolgye-dong, Nowon-ku, Seoul 139-701, Korea
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Abstract

Measurements of structural and electrical properties as a function of the molding pressure in Y1Ba2Cu3O7−δ superconductors have been performed to investigate the texturing behavior. The magnitudes of the molding pressure were 0.5 × 103 N/cm2, 1 × 103 N/cm2, 2 × 103 N/cm2, and 4 × 103 N/cm2. As the molding pressure increases, the anisotropy of the crystal structure decreases and the crystal grows preferentially along the c-axis. As the molding pressure increases, since the size of the grain becomes larger due to the decreased porosity, denser textures are formed. This result indicates that the critical current density is improved, resulting in increased thermal stability at higher molding pressure. While the molding pressure does not affect the oxygen mole fraction below 500 °C, increases in the molding pressure have a remarkable effect on the formation of textures and on the onset temperature for the superconducting transition in Y1Ba2Cu3O7−δ. These results indicate that structural and electrical properties in Y1Ba2Cu3O7−δ superconductors are affected by the molding pressure during growth.

Type
Articles
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.Wu, M. K., Ashburn, J.R., Torng, C. J., Hor, P. H., Meng, R. L., Gao, L., Huang, Z. J., Wang, Y. Q., and Chu, C. W., Phys. Rev. Lett. 58, 908 (1987).CrossRefGoogle Scholar
2.Hor, P. H., Gao, L., Meng, R. L., Huang, Z. J., Wang, Y. Q., Forster, K., Vassilious, J., and Chu, C. W., Phys. Rev. Lett. 58, 911 (1987).CrossRefGoogle Scholar
3.Driessen, A., Griessen, R., Koeman, N., Salomons, E., Brouwer, R., De Groot, D. G., Heeck, K., Hemmes, H., and Rector, J., Phys. Rev. B 36, 5602 (1987).CrossRefGoogle Scholar
4.Crommie, M. F., Liu, A. Y., Zettl, A., Cohen, M. L., Parilla, P., Hundley, M. F., Creager, W. N., Hoen, S., and Sherwin, M. S., Phys. Rev. B 39, 4231 (1989).CrossRefGoogle Scholar
5.Meingast, C., Blank, B., Bürkle, H., Obst, B., Wolf, T., Wühl, H., Selramanickan, V., and Salama, K., Phys. Rev. B 41, 11 299 (1990).CrossRefGoogle Scholar
6.Markert, J. T., Beille, J., Neumeier, J. J., Early, E. A., Seaman, C. L., Moran, T., and Maple, M. B., Phys. Rev. Lett. 64, 80 (1990).CrossRefGoogle Scholar
7.Moulton, N. E., Wolf, S. A., Skelton, E. F., Lienberg, D. H., Vanderah, T. A., Hermann, A. M., and Duan, H. M., Phys. Rev. B 44, 12 632 (1991).CrossRefGoogle Scholar
8.Borges, H. A., Kwok, R., Thompson, J. D., Wells, G. L., Smith, J. L., Fisk, Z., and Peterson, D. E., Phys. Rev. B 36, 2404 (1987).CrossRefGoogle Scholar
9.Huber, J. G., Liverman, W. J., Xu, Y., and Moodenbaugh, A. R., Phys. Rev. B 41, 8757 (1990).CrossRefGoogle Scholar
10.Al-Shibani, K., Al-Aql, A., Al-Muezzin, A., Humedia, H., Nakhmedov, E. P., Firat, T., Ozturk, O., and Sacli, O. A., Phys. Status Solidi (b) 189, 177 (1995).CrossRefGoogle Scholar
11.Yamada, Y., Matsumoto, T., Kaieda, Y., and Mori, N., Jpn. J. Appl. Phys. 29, L250 (1990).CrossRefGoogle Scholar
12.Shimakawa, Y., Kubo, Y., Manako, T., and Igarashi, H., Phys. Rev. B 40, 11 400 (1989).CrossRefGoogle Scholar
13.Siegrist, T., Sunshine, S., Murphy, D. W., Cava, R. J., and Zahurak, S. M., Phys. Rev. B 35, 7137 (1987).CrossRefGoogle Scholar
14.Macfarlane, R. M., Rosen, H. J., Engler, E. M., Jacowitz, R. D., and Lee, V. Y., Phys. Rev. B 38, 284 (1988).CrossRefGoogle Scholar
15.Kubo, Y. and Igarashi, H., Phys. Rev. B 39, 725 (1989).CrossRefGoogle Scholar