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Effect of Si2N2O content on the microstructure, properties, and erosion of silicon nitride–Si2N2O in situ composites

Published online by Cambridge University Press:  31 January 2011

Dong-Soo Park ,
Hyun-Ju Choi ,
Byung-Dong Han ,
Hai-Doo Kim  and
Dae-Soon Lim
Dong-Soo Park
Affiliation:
Ceramic Materials Group, Korea Institute of Machinery and Materials, 66 Sang-Nam-Dong, Chang-Won, Kyong-Nam, Korea
Hyun-Ju Choi
Affiliation:
Department of Materials Engineering, Korea University, An-Am-Dong, Sung-Buk-Gu, Seoul, Korea
Byung-Dong Han
Affiliation:
Ceramic Materials Group, Korea Institute of Machinery and Materials, 66 Sang-Nam-Dong, Chang-Won, Kyong-Nam, Korea
Hai-Doo Kim
Affiliation:
Ceramic Materials Group, Korea Institute of Machinery and Materials, 66 Sang-Nam-Dong, Chang-Won, Kyong-Nam, Korea
Dae-Soon Lim
Affiliation:
Department of Materials Engineering, Korea University, An-Am-Dong, Sung-Buk-Gu, Seoul, Korea
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Abstract

Silicon nitride–Si2N2O in situ composites were prepared by hot pressing powder mixtures of α–Si3N4, 6 wt% Y2O3, 1 wt% Al2O3, and 0–12 wt% SiO2. X-ray diffraction (XRD) analysis indicated that the volume percents of Si2N2O were 0, 13, 31, and 54 for the composites prepared with 0, 4, 8, and 12 wt% SiO2, respectively. XRD results also indicated that both silicon nitride grains and Si2N2O grains were laid down perpendicular to hot pressing direction. As the volume percent of Si2N2O increased, the width and the amount of elongated silicon nitride grains decreased, but the fracture toughness increased. Young's modulus of the in situ composites decreased as the Si2N2O content was increased. The erosion rate decreased as the Si2N2O content was increased, in part, due to both the increased fracture toughness and the reduced grain size. Erosion of the composites occurred primarily due to the grain dislodgment. The sample without Si2N2O experienced micro-chipping due to transgranular fracture.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 9 , September 2002 , pp. 2275 - 2280
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1.Wada, S., in Erosion of Ceramic Materials, edited by Ritter, J.E. (Key Engineering Materials, Trans Tech Publications, Uetikon-Zuerich, Switzerland, 1992), Vol. 71, p. 51.Google Scholar
2.Zhang, Y., Cheng, Y-B., and Lathabai, S., J. Eur. Ceram. 21, 2435 (2001).CrossRefGoogle Scholar
3.Lawn, B., in Fracture of Brittle Solids, 2nd ed. (Cambridge University Press, London, United Kingdom, 1993), pp. 303–304.Google Scholar
4.Liu, D-M., Lin, J-T., and Lee, R.R-R., Ceram. Int. 24, 217 (1998).CrossRefGoogle Scholar
5.Ohashi, M., Kanzaki, S., and Tabata, H., Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi, 96, 1073 (1988).CrossRefGoogle Scholar
6.Emoto, H., Mitomo, M., Wang, C-M., Hirosturu, H., and Inaba, T., J. Eur. Ceram. Soc. 18, 527 (1998).Google Scholar
7.Wiedhorn, S.M. and Hockey, B.J., J. Mater. Sci. 18, 766 (1983).Google Scholar
8.Wada, S., J. Ceram. Soc. Jpn. 104, 247 (1996).Google Scholar
9.Evans, A.G. and Charles, E.A., J. Am. Ceram. Soc. 59, 371 (1976).CrossRefGoogle Scholar
10.Park, D-S., Roh, T-W., Han, B-D., Kim, H-D., Park, C., J. Eur. Ceram. Soc. 22, 535 (2002).Google Scholar
11.Lee, F., Sandlin, M.S., and Bowman, K.J., J. Am. Ceram. Soc. 76, 1793 (1993).CrossRefGoogle Scholar
12.Wang, C., Emoto, H., and Mitomo, M., J. Am. Ceram. Soc. 81, 1125 (1998).Google Scholar
13.Ohashi, M., Nakamura, K., Hirao, K., Toriyama, M., and Kanzaki, S., Ceram. Int. 23, 27 (1997).CrossRefGoogle Scholar
14.Cho, S.J., Hockey, B.J., Lawn, B.R., and Bennison, S.J., J. Am. Ceram. Soc. 72, 1249 (1989).CrossRefGoogle Scholar
15.Lawn, B.R., J. Am. Ceram. Soc. 81, 1977 (1988).CrossRefGoogle Scholar